Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections

Ken Suzuki, Ryota Mizuno, Yutaro Nakoshi, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, the effect of crystallinity of grain and grain boundaries in electroplated gold thin-film interconnections on their electromigation (EM) resistance was investigated experimentally. The activation energy in Black's equation was evaluated by accelerated EM test and Arrhenius plot as a function of the crystallinity of the interconnection. The activation energy in the electroplated gold thin-film interconnection was increased from 0.54 to 0.61 eV by improving the crystallinity due to the annealing at 400°C after electroplating. The lifetime of the interconnection was estimated by using the evaluated activation energy. The estimated result showed that the lifetime of the interconnection annealed at 400°C was about 20 times longer than that of as-electroplated interconnection. Therefore, the control of the crystallinity is indispensable for improving the reliability of electronic devices.

Original languageEnglish
Title of host publicationIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728148700
DOIs
Publication statusPublished - 2019 Oct
Event2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan
Duration: 2019 Oct 82019 Oct 10

Publication series

NameIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

Conference

Conference2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
CountryJapan
CitySendai
Period19/10/819/10/10

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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