Crystallinity dependence of grain and grain boundary strength of a bicrystal structure of copper

Ken Suzuki, Yiqing Fan, Yifan Luo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electroplated copper thin films often contain porous grain boundaries and the volume ratio of porous grain boundaries in the copper thin films is much larger than that in bulk copper. Thus, the lifetime of the interconnection components fabricated by electroplating is strongly dominated by the strength of grain boundaries because final fracture caused by the acceleration of atomic diffusion during electromigration (EM) occurs at grain boundaries in polycrystalline interconnections. It is important, therefore, to quantitatively evaluate the grain boundary strength of electroplated copper films for estimating the lifetime of the interconnection in order to assure the product reliability. In this study, relationship between the strength and crystallinity of electroplated copper thin films was investigated experimentally and theoretically. In order to investigate the relationship between the strength and grain boundary quality, molecular dynamics (MD) simulations were applied to analyze the deformation behavior of a bicrystal sample and its strength. The variation of the strength and deformation property were attributed to the higher defect density around grain boundaries.

Original languageEnglish
Title of host publicationMicro- and Nano-Systems Engineering and Packaging
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791884652
DOIs
Publication statusPublished - 2020
EventASME 2020 International Mechanical Engineering Congress and Exposition, IMECE 2020 - Virtual, Online
Duration: 2020 Nov 162020 Nov 19

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume13

Conference

ConferenceASME 2020 International Mechanical Engineering Congress and Exposition, IMECE 2020
CityVirtual, Online
Period20/11/1620/11/19

Keywords

  • Crystallinity
  • Electroplated copper interconnection
  • Molecular Dynamics
  • Strength of a grain boundary

ASJC Scopus subject areas

  • Mechanical Engineering

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