TY - GEN
T1 - Crystallinity control of the electroplated copper thin film interconnections for advanced electronic devices
AU - Mizuno, Ryota
AU - Suzuki, Ken
AU - Miura, Hideo
N1 - Funding Information:
This research activity has been supported partially by Japanese Grants-in-aid for Scientific Research, and Tohoku University. This research was supported partly by JSPS KAKENHI Grant Number JP16H06357.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/1
Y1 - 2017/7/1
N2 - Electroplated copper thin film interconnections have been used in advanced semiconductor devices. However, it was found that the electrical properties of the electroplated copper thin film vary drastically depending on its micro texture such as low crystallinity grains and grain boundaries, and fine columnar structure. Therefore, in this study, the effect of the introduction of the tantalum-oxide layer between a tantalum barrier layer and a copper seed layer was evaluated by using XRD (X-Ray diffraction) and EBSD (Electron Back-scatter Diffraction) analyses for the improvement of the crystallinity. The crystallinity improved drastically by introducing the tantalum-oxide layer and thus, both the reliability and stability of the electroplated copper thin film were clearly improved.
AB - Electroplated copper thin film interconnections have been used in advanced semiconductor devices. However, it was found that the electrical properties of the electroplated copper thin film vary drastically depending on its micro texture such as low crystallinity grains and grain boundaries, and fine columnar structure. Therefore, in this study, the effect of the introduction of the tantalum-oxide layer between a tantalum barrier layer and a copper seed layer was evaluated by using XRD (X-Ray diffraction) and EBSD (Electron Back-scatter Diffraction) analyses for the improvement of the crystallinity. The crystallinity improved drastically by introducing the tantalum-oxide layer and thus, both the reliability and stability of the electroplated copper thin film were clearly improved.
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U2 - 10.1109/IMPACT.2017.8255899
DO - 10.1109/IMPACT.2017.8255899
M3 - Conference contribution
AN - SCOPUS:85045136381
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 62
EP - 65
BT - IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PB - IEEE Computer Society
T2 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
Y2 - 25 October 2017 through 27 October 2017
ER -