Cross comparison of thin film tensile-testing methods examined with single-crystal silicon, polysilicon, nickel, and titanium films

Toshiyuki Tsuchiya, Masakazu Hirata, Norio Chiba, Ryujiro Udo, Yuji Yoshitomi, Taeko Ando, Kazuo Sato, Kazuki Takashima, Yakichi Higo, Yasunori Saotome, Hirofumi Ogawa, Koichi Ozaki

Research output: Contribution to conferencePaperpeer-review

16 Citations (Scopus)

Abstract

This paper reports the results of a comparison of the different types of tensile testing methods used to evaluate thin films properties. We tested the same material fabricated on a single wafer using different testing techniques at five different research institutions. The testing methods are different in the way of gripping the specimen. Materials tested were single-crystal silicon, polysilicon, nickel, and titanium films. Specimens of three different shapes were processed through the same fabrication steps. The tensile strength, fracture strain, and Young's modulus of the films were measured and compared. The measured values of the mechanical properties were in good agreement with each other among the testing methods, thus demonstrating the accuracy of these testing methods.

Original languageEnglish
Pages666-669
Number of pages4
Publication statusPublished - 2003 Jul 23
EventIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan
Duration: 2003 Jan 192003 Jan 23

Other

OtherIEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems
CountryJapan
CityKyoto
Period03/1/1903/1/23

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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