Cross comparison of thin film tensile-testing methods examined with single-crystal silicon, polysilicon, nickel, and titanium films

Toshiyuki Tsuchiya; Masakazu Hirata; Norio Chiba; Ryujiro Udo; Yuji Yoshitomi; Taeko Ando; Kazuo Sato; Kazuki Takashima; Yakichi Higo; Yasunori Saotome; Hirofumi Ogawa; Koichi Ozaki

Cross comparison of thin film tensile-testing methods examined with single-crystal silicon, polysilicon, nickel, and titanium films

Toshiyuki Tsuchiya, Masakazu Hirata, Norio Chiba, Ryujiro Udo, Yuji Yoshitomi, Taeko Ando, Kazuo Sato, Kazuki Takashima, Yakichi Higo, Yasunori Saotome, Hirofumi Ogawa, Koichi Ozaki

Institute for Materials Research (IMR)

Research output: Contribution to conference › Paper › peer-review

16 Citations (Scopus)

Abstract

This paper reports the results of a comparison of the different types of tensile testing methods used to evaluate thin films properties. We tested the same material fabricated on a single wafer using different testing techniques at five different research institutions. The testing methods are different in the way of gripping the specimen. Materials tested were single-crystal silicon, polysilicon, nickel, and titanium films. Specimens of three different shapes were processed through the same fabrication steps. The tensile strength, fracture strain, and Young's modulus of the films were measured and compared. The measured values of the mechanical properties were in good agreement with each other among the testing methods, thus demonstrating the accuracy of these testing methods.

Original language	English
Pages	666-669
Number of pages	4
Publication status	Published - 2003 Jul 23
Event	IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan Duration: 2003 Jan 19 → 2003 Jan 23

Other

Other	IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems
Country	Japan
City	Kyoto
Period	03/1/19 → 03/1/23

ASJC Scopus subject areas

Control and Systems Engineering
Mechanical Engineering
Electrical and Electronic Engineering

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Tsuchiya, T., Hirata, M., Chiba, N., Udo, R., Yoshitomi, Y., Ando, T., Sato, K., Takashima, K., Higo, Y., Saotome, Y., Ogawa, H., & Ozaki, K. (2003). Cross comparison of thin film tensile-testing methods examined with single-crystal silicon, polysilicon, nickel, and titanium films. 666-669. Paper presented at IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems, Kyoto, Japan.

Cross comparison of thin film tensile-testing methods examined with single-crystal silicon, polysilicon, nickel, and titanium films. / Tsuchiya, Toshiyuki; Hirata, Masakazu; Chiba, Norio; Udo, Ryujiro; Yoshitomi, Yuji; Ando, Taeko; Sato, Kazuo; Takashima, Kazuki; Higo, Yakichi; Saotome, Yasunori; Ogawa, Hirofumi; Ozaki, Koichi.

2003. 666-669 Paper presented at IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems, Kyoto, Japan.

Research output: Contribution to conference › Paper › peer-review

Tsuchiya, T, Hirata, M, Chiba, N, Udo, R, Yoshitomi, Y, Ando, T, Sato, K, Takashima, K, Higo, Y, Saotome, Y, Ogawa, H & Ozaki, K 2003, 'Cross comparison of thin film tensile-testing methods examined with single-crystal silicon, polysilicon, nickel, and titanium films', Paper presented at IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems, Kyoto, Japan, 03/1/19 - 03/1/23 pp. 666-669.

Tsuchiya, Toshiyuki ; Hirata, Masakazu ; Chiba, Norio ; Udo, Ryujiro ; Yoshitomi, Yuji ; Ando, Taeko ; Sato, Kazuo ; Takashima, Kazuki ; Higo, Yakichi ; Saotome, Yasunori ; Ogawa, Hirofumi ; Ozaki, Koichi. / Cross comparison of thin film tensile-testing methods examined with single-crystal silicon, polysilicon, nickel, and titanium films. Paper presented at IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems, Kyoto, Japan.4 p.

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AU - Yoshitomi, Yuji

AU - Ando, Taeko

AU - Sato, Kazuo

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