TY - JOUR
T1 - Cross comparison of thin-film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel, and titanium films
AU - Tsuchiya, Toshiyuki
AU - Hirata, Masakazu
AU - Chiba, Norio
AU - Udo, Ryujiro
AU - Yoshitomi, Yuji
AU - Ando, Taeko
AU - Sato, Kazuo
AU - Takashima, Kazuki
AU - Higo, Yakichi
AU - Saotome, Yasunori
AU - Ogawa, Hirofumi
AU - Ozaki, Koichi
PY - 2005/10/1
Y1 - 2005/10/1
N2 - This paper reports on the results of comparing different types of tensile testing methods that are used to evaluate thin-film properties. We tested the same material fabricated on a single wafer using different testing techniques at five different research institutions. The testing methods were different in the way the specimen was gripped. Materials tested were single-crystal silicon (SCS), polysilicon, nickel, and titanium films. Specimens with three different shapes were processed through the same fabrication steps. The tensile strength, fracture strain, and Young's modulus of the films were measured and compared. The measured values of the mechanical properties of all the testing methods were in good agreement with each other, thus demonstrating their accuracy.
AB - This paper reports on the results of comparing different types of tensile testing methods that are used to evaluate thin-film properties. We tested the same material fabricated on a single wafer using different testing techniques at five different research institutions. The testing methods were different in the way the specimen was gripped. Materials tested were single-crystal silicon (SCS), polysilicon, nickel, and titanium films. Specimens with three different shapes were processed through the same fabrication steps. The tensile strength, fracture strain, and Young's modulus of the films were measured and compared. The measured values of the mechanical properties of all the testing methods were in good agreement with each other, thus demonstrating their accuracy.
KW - Mechanical properties
KW - Standardization
KW - Tensile testing
KW - Thin film
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U2 - 10.1109/JMEMS.2005.851820
DO - 10.1109/JMEMS.2005.851820
M3 - Article
AN - SCOPUS:27644572982
VL - 14
SP - 1178
EP - 1186
JO - Journal of Microelectromechanical Systems
JF - Journal of Microelectromechanical Systems
SN - 1057-7157
IS - 5
ER -