TY - GEN
T1 - CREEP-FATIGUE DAMAGE OF HEAT-RESISTANT ALLOYS CAUSED BY THE LOCAL LATTICE MISMATCH-INDUCED ACCELERATION OF THE GENERATION AND ACCUMULATION OF DISLOCATIONS AND VACANCIES
AU - Luo, Yifan
AU - Tezuka, Shogo
AU - Nakayama, Koki
AU - Nakayama, Ayumi
AU - Suzuki, Ken
AU - Miura, Hideo
N1 - Funding Information:
This research activity has been supported partially by Japanese special coordination funds for promoting science and technology, Japanese Grants-in-aid for Scientific Research, and Tohoku University. This research was supported partly by JSPS KAKENHI Grant Numbers JP16H06357 and 21H01205.
Publisher Copyright:
Copyright © 2021 by ASME
PY - 2021
Y1 - 2021
N2 - Degradation mechanism of the strength of a grain boundary in Ni-base superalloy under creep-fatigue loading at elevated temperature was investigated by using the modified Arrhenius equation, which explained the stress-induced acceleration of the local generation and diffusion of dislocations and vacancies. EBSD analysis confirmed that dislocations and vacancies started to generate and accumulate around grain boundaries and the interface between precipitates and matrix in grains. The generation and accumulation were accelerated around the interfaces with large difference in the lattice constant between the nearby crystallographic phases and grains. The activation energies of the diffusion of dislocations and vacancies measured under the harsh condition was much lower than those measured under the thermodynamically stable conditions. It was confirmed that there are two main acceleration mechanisms of the degradation of the crystallinity and strength of grain boundaries under a tensile stress at elevated temperatures: the acceleration of the generation and diffusion of dislocations and the acceleration of accumulation of voids due to the outward diffusion of component atoms from the grain boundaries. These phenomena were explained by the modified Arrhenius equations in which the effective activation energies were changed by the summation of the applied nominal stress and the localized internal stress around various interfaces quantitatively.
AB - Degradation mechanism of the strength of a grain boundary in Ni-base superalloy under creep-fatigue loading at elevated temperature was investigated by using the modified Arrhenius equation, which explained the stress-induced acceleration of the local generation and diffusion of dislocations and vacancies. EBSD analysis confirmed that dislocations and vacancies started to generate and accumulate around grain boundaries and the interface between precipitates and matrix in grains. The generation and accumulation were accelerated around the interfaces with large difference in the lattice constant between the nearby crystallographic phases and grains. The activation energies of the diffusion of dislocations and vacancies measured under the harsh condition was much lower than those measured under the thermodynamically stable conditions. It was confirmed that there are two main acceleration mechanisms of the degradation of the crystallinity and strength of grain boundaries under a tensile stress at elevated temperatures: the acceleration of the generation and diffusion of dislocations and the acceleration of accumulation of voids due to the outward diffusion of component atoms from the grain boundaries. These phenomena were explained by the modified Arrhenius equations in which the effective activation energies were changed by the summation of the applied nominal stress and the localized internal stress around various interfaces quantitatively.
KW - Degradation of crystallinity
KW - EBSD analysis
KW - Strength of a grain boundary
KW - Stress-induced migration
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U2 - 10.1115/IMECE2021-68489
DO - 10.1115/IMECE2021-68489
M3 - Conference contribution
AN - SCOPUS:85124381064
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
BT - Mechanics of Solids, Structures, and Fluids; Micro- and Nano- Systems Engineering and Packaging
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2021 International Mechanical Engineering Congress and Exposition, IMECE 2021
Y2 - 1 November 2021 through 5 November 2021
ER -