Crack disappearance by high-temperature oxidation of alumina toughened by Ni nano-particles

Ana L. Salas-Villaseñor; Jose Lemus-Ruiz; Makoto Nanko; Daisuke Maruoka

doi:10.4028/www.scientific.net/AMR.68.34

Crack disappearance by high-temperature oxidation of alumina toughened by Ni nano-particles

Ana L. Salas-Villaseñor, Jose Lemus-Ruiz, Makoto Nanko, Daisuke Maruoka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

19 Citations (Scopus)

Abstract

Crack disappearance by high-temperature oxidation was studied in alumina (Al₂O₃) composites toughened by Ni nanoparticles. This process is performed in air at temperature ranging from 1000 to 1300°C for 1 to 48 h. The results showed that crack disappearance depends on both annealing temperature and time. Complete crack disappearance in this composite was confirmed at lower temperatures for long oxidation period, 1100°C for 48 h, and higher temperature for shorter time, 1300°C for 1 h in air. The crack disappearance mechanism was explained on the basis of the formation of NiAl ₂O₄ spinel on sample surfaces produced by the oxidation reaction during the heat treatment.

Original language	English
Title of host publication	Advances in Semiconducting Materials
Pages	34-43
Number of pages	10
DOIs	https://doi.org/10.4028/www.scientific.net/AMR.68.34
Publication status	Published - 2009
Externally published	Yes
Event	Advances in Semiconducting Materials - Cancun, Quintana Roo, Mexico Duration: 2007 Oct 28 → 2007 Nov 1

Publication series

Name	Advanced Materials Research
Volume	68
ISSN (Print)	1022-6680

Other

Other	Advances in Semiconducting Materials
Country/Territory	Mexico
City	Cancun, Quintana Roo
Period	07/10/28 → 07/11/1

Keywords

Alumina
Composites
Crack healing
Diffusion
High temperature oxidation
Nickel

ASJC Scopus subject areas

Engineering(all)

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10.4028/www.scientific.net/AMR.68.34

Cite this

Salas-Villaseñor, AL, Lemus-Ruiz, J, Nanko, M & Maruoka, D 2009, Crack disappearance by high-temperature oxidation of alumina toughened by Ni nano-particles. in Advances in Semiconducting Materials. Advanced Materials Research, vol. 68, pp. 34-43, Advances in Semiconducting Materials, Cancun, Quintana Roo, Mexico, 07/10/28. https://doi.org/10.4028/www.scientific.net/AMR.68.34

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title = "Crack disappearance by high-temperature oxidation of alumina toughened by Ni nano-particles",

abstract = "Crack disappearance by high-temperature oxidation was studied in alumina (Al2O3) composites toughened by Ni nanoparticles. This process is performed in air at temperature ranging from 1000 to 1300°C for 1 to 48 h. The results showed that crack disappearance depends on both annealing temperature and time. Complete crack disappearance in this composite was confirmed at lower temperatures for long oxidation period, 1100°C for 48 h, and higher temperature for shorter time, 1300°C for 1 h in air. The crack disappearance mechanism was explained on the basis of the formation of NiAl 2O4 spinel on sample surfaces produced by the oxidation reaction during the heat treatment.",

keywords = "Alumina, Composites, Crack healing, Diffusion, High temperature oxidation, Nickel",

author = "Salas-Villase{\~n}or, {Ana L.} and Jose Lemus-Ruiz and Makoto Nanko and Daisuke Maruoka",

year = "2009",

doi = "10.4028/www.scientific.net/AMR.68.34",

language = "English",

isbn = "0878493239",

series = "Advanced Materials Research",

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T1 - Crack disappearance by high-temperature oxidation of alumina toughened by Ni nano-particles

AU - Salas-Villaseñor, Ana L.

AU - Lemus-Ruiz, Jose

AU - Nanko, Makoto

AU - Maruoka, Daisuke

PY - 2009

Y1 - 2009

N2 - Crack disappearance by high-temperature oxidation was studied in alumina (Al2O3) composites toughened by Ni nanoparticles. This process is performed in air at temperature ranging from 1000 to 1300°C for 1 to 48 h. The results showed that crack disappearance depends on both annealing temperature and time. Complete crack disappearance in this composite was confirmed at lower temperatures for long oxidation period, 1100°C for 48 h, and higher temperature for shorter time, 1300°C for 1 h in air. The crack disappearance mechanism was explained on the basis of the formation of NiAl 2O4 spinel on sample surfaces produced by the oxidation reaction during the heat treatment.

AB - Crack disappearance by high-temperature oxidation was studied in alumina (Al2O3) composites toughened by Ni nanoparticles. This process is performed in air at temperature ranging from 1000 to 1300°C for 1 to 48 h. The results showed that crack disappearance depends on both annealing temperature and time. Complete crack disappearance in this composite was confirmed at lower temperatures for long oxidation period, 1100°C for 48 h, and higher temperature for shorter time, 1300°C for 1 h in air. The crack disappearance mechanism was explained on the basis of the formation of NiAl 2O4 spinel on sample surfaces produced by the oxidation reaction during the heat treatment.

KW - Alumina

KW - Composites

KW - Crack healing

KW - Diffusion

KW - High temperature oxidation

KW - Nickel

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BT - Advances in Semiconducting Materials

T2 - Advances in Semiconducting Materials

Y2 - 28 October 2007 through 1 November 2007

ER -

Crack disappearance by high-temperature oxidation of alumina toughened by Ni nano-particles

Abstract

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Keywords

ASJC Scopus subject areas

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