Copper precipitation in Cu-implanted Fe films

M. Murayama, K. Takahiro, S. Nagata, T. Konno, S. Yamaguchi

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


The precipitation behavior of Cu-rich precipitates in Cu-implanted Fe films has been studied using transmission electron microscopy and electron diffraction. The results show that micro-twins which lie parallel to a (112)bcc plane as well as spherical copper particles with diameter less than 5 nm are observed in the as-implanted specimens. Upon thermal ageing, the precipitation in the Cu-implanted Fe films proceeds more rapidly than it does in the corresponding Fe-Cu alloys, and large copper precipitates are observed to grow near the micro-twins.

Original languageEnglish
Pages (from-to)74-77
Number of pages4
JournalSurface and Coatings Technology
Issue number1-3
Publication statusPublished - 1996 Sep


  • Cu implantation
  • Cu precipitation
  • Electron microscopy
  • Fe-Cu alloy

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry


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