TY - JOUR
T1 - Copper film prepared from copper fine particle paste by laser sintering at room temperature
T2 - Influences of sintering atmosphere on the morphology and resistivity
AU - Qin, Gang
AU - Watanabe, Akira
AU - Tsukamoto, Hiroki
AU - Yonezawa, Tetsu
N1 - Copyright:
Copyright 2014 Elsevier B.V., All rights reserved.
PY - 2014
Y1 - 2014
N2 - Laser sintering method was applied for copper fine particle paste to generate electrically conductive copper film. The one-step sintering of the copper fine particle coating films at room temperature was carried out by scanning irradiation of a line-shaped laser beam under various atmospheric conditions. The laser sintering of the copper fine particle coating film under a hydrogen/argon (4/96) gas mixture flow gave a copper film with a low resistivity of 1.05 × 10-5Ωcm. The scanning electron microscope (SEM) image of the laser sintered film showed the necking among copper fine particles. The film laser-sintered in air was insulator which showed the Raman band assigned to Cu2O. The laser sintering of the copper fine particle coating film under argon gas flow gave also copper films with resistivities of the order of 10-5Ωcm, which depended on the flow rate of argon gas. On the other hand, the film sintered by conventional heat treatment at 300 °C under argon gas flow showed a high resistivity. The formation of a copper wiring with several micrometers resolution was achieved by laser direct writing using copper fine particle with the size larger than 100nm. The advantages of the laser sintering in the preparation of a conductive film from copper fine particle paste were demonstrated.
AB - Laser sintering method was applied for copper fine particle paste to generate electrically conductive copper film. The one-step sintering of the copper fine particle coating films at room temperature was carried out by scanning irradiation of a line-shaped laser beam under various atmospheric conditions. The laser sintering of the copper fine particle coating film under a hydrogen/argon (4/96) gas mixture flow gave a copper film with a low resistivity of 1.05 × 10-5Ωcm. The scanning electron microscope (SEM) image of the laser sintered film showed the necking among copper fine particles. The film laser-sintered in air was insulator which showed the Raman band assigned to Cu2O. The laser sintering of the copper fine particle coating film under argon gas flow gave also copper films with resistivities of the order of 10-5Ωcm, which depended on the flow rate of argon gas. On the other hand, the film sintered by conventional heat treatment at 300 °C under argon gas flow showed a high resistivity. The formation of a copper wiring with several micrometers resolution was achieved by laser direct writing using copper fine particle with the size larger than 100nm. The advantages of the laser sintering in the preparation of a conductive film from copper fine particle paste were demonstrated.
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U2 - 10.7567/JJAP.53.096501
DO - 10.7567/JJAP.53.096501
M3 - Article
AN - SCOPUS:84906876092
VL - 53
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 9
M1 - 096501
ER -