Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules

Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

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Engineering & Materials Science