Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules

Satoshi Yoshida, Shoichi Tanifuji, Suguru Kameda, Noriharu Suematsu, Tadashi Takagi, Kazuo Tsubouchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

In this paper, we propose a novel copper balls interconnection technology for 60 GHz band 3-D system-in-package (SiP) modules for 10mm square 60 GHz band ultra-small wireless personal area network (WPAN) using organic substrates. Copper ball diameter of 350 μm is used for interconnection between the substrates. Ground copper balls placement is discussed showing electric field distribution. As a result, six ground copper balls around vertical signal line interconnection part are crucial for improvement of transmission characteristics. The six ground copper balls interconnection structure have similar results up to about 70GHz for S21 compared with through CPW, hence copper balls interconnection technology is usable up to about 70 GHz.

Original languageEnglish
Title of host publication2010 Asia-Pacific Microwave Conference Proceedings, APMC 2010
Pages904-907
Number of pages4
Publication statusPublished - 2010 Dec 1
Event2010 Asia-Pacific Microwave Conference, APMC 2010 - Yokohama, Japan
Duration: 2010 Dec 72010 Dec 10

Other

Other2010 Asia-Pacific Microwave Conference, APMC 2010
CountryJapan
CityYokohama
Period10/12/710/12/10

Keywords

  • 60 GHz
  • millimeter-wave
  • small terminal
  • system-in-package
  • WPAN

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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