TY - GEN
T1 - Cooling performance of compact heat sinks with semimicrochannels
AU - Ohara, Taku
AU - Aihara, Toshio
AU - Hayashi, Chihiro
PY - 1992/12/1
Y1 - 1992/12/1
N2 - A highly compact heat sink has been developed for forced air cooling of LSI packages and heat dissipation and pressure drop performance of the heat sink have been experimentally studied. These heat sinks have a remarkable feature of extremely narrow fin spacing, and hence, large heat-transfer area per unit heat-sink volume. The streamwise fin length was designed to be short to prevent an excessive pressure drop of the air flow. The cooling performance of these heat sinks in forced air flow was measured carefully and compared with that of a typical heat sink commercially used for the cooling of LSI packages. It is shown that the new-type heat sinks have highly improved performance in regard to compactness.
AB - A highly compact heat sink has been developed for forced air cooling of LSI packages and heat dissipation and pressure drop performance of the heat sink have been experimentally studied. These heat sinks have a remarkable feature of extremely narrow fin spacing, and hence, large heat-transfer area per unit heat-sink volume. The streamwise fin length was designed to be short to prevent an excessive pressure drop of the air flow. The cooling performance of these heat sinks in forced air flow was measured carefully and compared with that of a typical heat sink commercially used for the cooling of LSI packages. It is shown that the new-type heat sinks have highly improved performance in regard to compactness.
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M3 - Conference contribution
AN - SCOPUS:0027043867
SN - 0791807665
T3 - American Society of Mechanical Engineers, EEP
SP - 249
EP - 252
BT - American Society of Mechanical Engineers, EEP
PB - Publ by ASME
T2 - Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
Y2 - 9 April 1992 through 12 April 1992
ER -