Cooling performance of compact heat sinks with semimicrochannels

Taku Ohara, Toshio Aihara, Chihiro Hayashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

A highly compact heat sink has been developed for forced air cooling of LSI packages and heat dissipation and pressure drop performance of the heat sink have been experimentally studied. These heat sinks have a remarkable feature of extremely narrow fin spacing, and hence, large heat-transfer area per unit heat-sink volume. The streamwise fin length was designed to be short to prevent an excessive pressure drop of the air flow. The cooling performance of these heat sinks in forced air flow was measured carefully and compared with that of a typical heat sink commercially used for the cooling of LSI packages. It is shown that the new-type heat sinks have highly improved performance in regard to compactness.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, EEP
PublisherPubl by ASME
Pages249-252
Number of pages4
ISBN (Print)0791807665
Publication statusPublished - 1992 Dec 1
EventProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
Duration: 1992 Apr 91992 Apr 12

Publication series

NameAmerican Society of Mechanical Engineers, EEP
Volume1

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
CityMilpitas, CA, USA
Period92/4/992/4/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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