Cooling performance of compact heat sinks with semimicrochannels

Taku Ohara; Toshio Aihara; Chihiro Hayashi

Cooling performance of compact heat sinks with semimicrochannels

Taku Ohara, Toshio Aihara, Chihiro Hayashi

Nanoscale Flow Research Division

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

A highly compact heat sink has been developed for forced air cooling of LSI packages and heat dissipation and pressure drop performance of the heat sink have been experimentally studied. These heat sinks have a remarkable feature of extremely narrow fin spacing, and hence, large heat-transfer area per unit heat-sink volume. The streamwise fin length was designed to be short to prevent an excessive pressure drop of the air flow. The cooling performance of these heat sinks in forced air flow was measured carefully and compared with that of a typical heat sink commercially used for the cooling of LSI packages. It is shown that the new-type heat sinks have highly improved performance in regard to compactness.

Original language	English
Title of host publication	American Society of Mechanical Engineers, EEP
Publisher	Publ by ASME
Pages	249-252
Number of pages	4
ISBN (Print)	0791807665
Publication status	Published - 1992 Dec 1
Event	Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA Duration: 1992 Apr 9 → 1992 Apr 12

Publication series

Name	American Society of Mechanical Engineers, EEP
Volume	1

Other

Other	Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
City	Milpitas, CA, USA
Period	92/4/9 → 92/4/12

ASJC Scopus subject areas

Electrical and Electronic Engineering
Mechanical Engineering

Cite this

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title = "Cooling performance of compact heat sinks with semimicrochannels",

abstract = "A highly compact heat sink has been developed for forced air cooling of LSI packages and heat dissipation and pressure drop performance of the heat sink have been experimentally studied. These heat sinks have a remarkable feature of extremely narrow fin spacing, and hence, large heat-transfer area per unit heat-sink volume. The streamwise fin length was designed to be short to prevent an excessive pressure drop of the air flow. The cooling performance of these heat sinks in forced air flow was measured carefully and compared with that of a typical heat sink commercially used for the cooling of LSI packages. It is shown that the new-type heat sinks have highly improved performance in regard to compactness.",

author = "Taku Ohara and Toshio Aihara and Chihiro Hayashi",

year = "1992",

month = dec,

day = "1",

language = "English",

isbn = "0791807665",

series = "American Society of Mechanical Engineers, EEP",

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pages = "249--252",

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note = "Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) ; Conference date: 09-04-1992 Through 12-04-1992",

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T1 - Cooling performance of compact heat sinks with semimicrochannels

AU - Ohara, Taku

AU - Aihara, Toshio

AU - Hayashi, Chihiro

PY - 1992/12/1

Y1 - 1992/12/1

N2 - A highly compact heat sink has been developed for forced air cooling of LSI packages and heat dissipation and pressure drop performance of the heat sink have been experimentally studied. These heat sinks have a remarkable feature of extremely narrow fin spacing, and hence, large heat-transfer area per unit heat-sink volume. The streamwise fin length was designed to be short to prevent an excessive pressure drop of the air flow. The cooling performance of these heat sinks in forced air flow was measured carefully and compared with that of a typical heat sink commercially used for the cooling of LSI packages. It is shown that the new-type heat sinks have highly improved performance in regard to compactness.

AB - A highly compact heat sink has been developed for forced air cooling of LSI packages and heat dissipation and pressure drop performance of the heat sink have been experimentally studied. These heat sinks have a remarkable feature of extremely narrow fin spacing, and hence, large heat-transfer area per unit heat-sink volume. The streamwise fin length was designed to be short to prevent an excessive pressure drop of the air flow. The cooling performance of these heat sinks in forced air flow was measured carefully and compared with that of a typical heat sink commercially used for the cooling of LSI packages. It is shown that the new-type heat sinks have highly improved performance in regard to compactness.

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UR - http://www.scopus.com/inward/citedby.url?scp=0027043867&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0027043867

SN - 0791807665

T3 - American Society of Mechanical Engineers, EEP

SP - 249

EP - 252

BT - American Society of Mechanical Engineers, EEP

PB - Publ by ASME

T2 - Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)

Y2 - 9 April 1992 through 12 April 1992

ER -

Cooling performance of compact heat sinks with semimicrochannels

Abstract

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ASJC Scopus subject areas

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