Control of compound forming reaction at the interface between SnZn solder and Cu substrate

Tetsu Ichitsubo, Eiichiro Matsubara, Kozo Fujiwara, Masahiko Yamaguchi, Hisao Irie, Seishi Kumamoto, Takaaki Anada

Research output: Contribution to journalArticlepeer-review

54 Citations (Scopus)


Effects of additives, Cu and Ni, on intermetallic compound formation at the interface between Sn-Zn-based solder and Cu substrate have been studied. (Sn91Zn9)99.98-xMxAl0.02 (wt.%) solder (M = Cu or Ni) alloys were prepared. The microstructures of the samples after annealing at 120 °C for 100 h were investigated using a scanning electron microscope, and the melting temperatures of the alloys were measured with a differential scanning calorimeter for different Cu or Ni contents. Although the melting (liquidus) temperature increases up to about 210-220 °C by alloying Cu or Ni of 2.6-2.7 wt.% to the solder, the well-known formation of intermetallic compounds, Cu5Zn8 and Sn6Cu5, are found to be significantly restrained.

Original languageEnglish
Pages (from-to)200-205
Number of pages6
JournalJournal of Alloys and Compounds
Issue number1-2
Publication statusPublished - 2005 Apr 19


  • Casting
  • Metals (Pb-free solder alloys)
  • Thermal analysis
  • X-ray
  • X-ray diffraction

ASJC Scopus subject areas

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry


Dive into the research topics of 'Control of compound forming reaction at the interface between SnZn solder and Cu substrate'. Together they form a unique fingerprint.

Cite this