Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC

Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Engineering & Materials Science