Conductive polymer/metal composite for filling of TSV

J. Kawakita; T. Chikyow

doi:10.1149/08004.0205ecst

Conductive polymer/metal composite for filling of TSV

J. Kawakita, T. Chikyow

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Toward fast formation of TSV for 3D-IC or 3D-LSI, a composite material with polypyrrole as a conducting polymer and metal silver prepared through the solution photo chemistry was studied with respect to filling status of vertical holes in silicon chip, electrical characteristics and interfacial structures between the filling composite and silicon substrate. Based on the experimental results, the composite was capable of filling within 10 minutes, evaluation procedures of electrical resistance were established and excellent barrier layer was found.

Original language	English
Title of host publication	ECS Transactions
Editors	K. Shiojima, A. Mai, J. Murota, P. Chin, C. L. Claeys, H. Iwai, S. Deleonibus, M. Tao
Publisher	Electrochemical Society Inc.
Pages	205-214
Number of pages	10
Edition	4
ISBN (Electronic)	9781607685395
DOIs	https://doi.org/10.1149/08004.0205ecst
Publication status	Published - 2017 Jan 1
Externally published	Yes
Event	10th Symposium on Semiconductor Process Integration - 232nd ECS Meeting - National Harbor, United States Duration: 2017 Oct 1 → 2017 Oct 5

Publication series

Name	ECS Transactions
Number	4
Volume	80
ISSN (Print)	1938-6737
ISSN (Electronic)	1938-5862

Conference

Conference	10th Symposium on Semiconductor Process Integration - 232nd ECS Meeting
Country	United States
City	National Harbor
Period	17/10/1 → 17/10/5

ASJC Scopus subject areas

Engineering(all)

Access to Document

10.1149/08004.0205ecst

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Conductive polymer/metal composite for filling of TSV. / Kawakita, J.; Chikyow, T.

ECS Transactions. ed. / K. Shiojima; A. Mai; J. Murota; P. Chin; C. L. Claeys; H. Iwai; S. Deleonibus; M. Tao. 4. ed. Electrochemical Society Inc., 2017. p. 205-214 (ECS Transactions; Vol. 80, No. 4).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kawakita, J & Chikyow, T 2017, Conductive polymer/metal composite for filling of TSV. in K Shiojima, A Mai, J Murota, P Chin, CL Claeys, H Iwai, S Deleonibus & M Tao (eds), ECS Transactions. 4 edn, ECS Transactions, no. 4, vol. 80, Electrochemical Society Inc., pp. 205-214, 10th Symposium on Semiconductor Process Integration - 232nd ECS Meeting, National Harbor, United States, 17/10/1. https://doi.org/10.1149/08004.0205ecst

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