Conductive polymer/metal composite for filling of TSV

J. Kawakita, T. Chikyow

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Toward fast formation of TSV for 3D-IC or 3D-LSI, a composite material with polypyrrole as a conducting polymer and metal silver prepared through the solution photo chemistry was studied with respect to filling status of vertical holes in silicon chip, electrical characteristics and interfacial structures between the filling composite and silicon substrate. Based on the experimental results, the composite was capable of filling within 10 minutes, evaluation procedures of electrical resistance were established and excellent barrier layer was found.

Original languageEnglish
Title of host publicationECS Transactions
EditorsK. Shiojima, A. Mai, J. Murota, P. Chin, C. L. Claeys, H. Iwai, S. Deleonibus, M. Tao
PublisherElectrochemical Society Inc.
Pages205-214
Number of pages10
Edition4
ISBN (Electronic)9781607685395
DOIs
Publication statusPublished - 2017 Jan 1
Externally publishedYes
Event10th Symposium on Semiconductor Process Integration - 232nd ECS Meeting - National Harbor, United States
Duration: 2017 Oct 12017 Oct 5

Publication series

NameECS Transactions
Number4
Volume80
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Conference

Conference10th Symposium on Semiconductor Process Integration - 232nd ECS Meeting
CountryUnited States
CityNational Harbor
Period17/10/117/10/5

ASJC Scopus subject areas

  • Engineering(all)

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