@inproceedings{72430f92b9e74e119f3e833e66528bb2,
title = "Conductive polymer/metal composite for filling of TSV",
abstract = "Toward fast formation of TSV for 3D-IC or 3D-LSI, a composite material with polypyrrole as a conducting polymer and metal silver prepared through the solution photo chemistry was studied with respect to filling status of vertical holes in silicon chip, electrical characteristics and interfacial structures between the filling composite and silicon substrate. Based on the experimental results, the composite was capable of filling within 10 minutes, evaluation procedures of electrical resistance were established and excellent barrier layer was found.",
author = "J. Kawakita and T. Chikyow",
year = "2017",
month = jan,
day = "1",
doi = "10.1149/08004.0205ecst",
language = "English",
series = "ECS Transactions",
publisher = "Electrochemical Society Inc.",
number = "4",
pages = "205--214",
editor = "K. Shiojima and A. Mai and J. Murota and P. Chin and Claeys, {C. L.} and H. Iwai and S. Deleonibus and M. Tao",
booktitle = "ECS Transactions",
edition = "4",
note = "10th Symposium on Semiconductor Process Integration - 232nd ECS Meeting ; Conference date: 01-10-2017 Through 05-10-2017",
}