Comprehensive study on wafer-level vacuum packaging using anodically-bondable LTCC wafer and thin film getter

Shuji Tanaka, Hideyuki Fukushi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

An anodically-bondable low-temperature cofired ceramic (LTCC) wafer is a new wafer-level packaging material for micro electro mechanical systems (MEMS). It provides 3-dimensional metal interconnection inside, and enables hermetic sealing, which was guaranteed by automobile-grade thermal cycling tests. In this study, the sealing pressure was first investigated under various anodic bonding conditions with and without two types of thin film getter (PaGe getter, Saes Getters or Ti getter). The vacuum sealing pressure was a few kPa or even higher, and more importantly, often different for each sample without the thin film getter. On the other hand, samples with the getter always exhibited good vacuum level, which was below the detection limit (80 Pa) of zero-balance method using a Si diaphragm. Typical process conditions for borosilicate glass on commercially-available bonding tools work well.

Original languageEnglish
Title of host publication2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages468-471
Number of pages4
ISBN (Electronic)9781479989553
DOIs
Publication statusPublished - 2015 Aug 5
Event18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
Duration: 2015 Jun 212015 Jun 25

Publication series

Name2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
CountryUnited States
CityAnchorage
Period15/6/2115/6/25

Keywords

  • Anodic bonding
  • Low temperature cofired ceramics (LTCC)
  • Thin film getter
  • Vacuum sealing
  • Wafer-level packaging

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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    Tanaka, S., & Fukushi, H. (2015). Comprehensive study on wafer-level vacuum packaging using anodically-bondable LTCC wafer and thin film getter. In 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 (pp. 468-471). [7180962] (2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2015.7180962