Composite monolayer of Ag and Cu on Au(111) by sequential underpotential deposition

Seiichi Takami, G. Kane Jennings, Paul E. Laibinis

Research output: Contribution to journalArticlepeer-review

20 Citations (Scopus)


The underpotential deposition (upd) of silver and copper onto Au(111) can be performed sequentially to produce a composite monolayer with a laterally mixed structure. In situ atomic force microscopy (AFM) was used to follow the upd processes on Au(111) under potential control in Ag+ and Cu2+ electrolytes. The first upd step in a sulfuric acid-based Ag+ electrolyte produced a partial monolayer of Ag atoms on Au(111). Cyclic voltammetry with this Au(111)/Ag upd sample in a Cu2+ electrolyte showed a upd peak in both the anodic and cathodic scans that was shifted by approximately -100 mV from that on bare Au(111). X-ray photoelectron spectroscopy and in situ AFM measurements revealed that the upd peaks for Cu on Au(111)/Ag resulted from the reversible transition in surface structure between an open hexagonal structure of Ag atoms on Au(111) and a (1 × 1) adlayer structure comprising both Ag and Cu atoms on the Au(111) surface. In formation of the (1 × 1) structure, the Cu atoms filled the open spaces on Au(111) created by the Ag upd layer.

Original languageEnglish
Pages (from-to)441-448
Number of pages8
Issue number2
Publication statusPublished - 2001 Jan 23

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Spectroscopy
  • Electrochemistry


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