Comparison of three methods to measure the internal pressure of empty MEMS packages

B. Wang, Shuji Tanaka, J. De Coster, S. Severi, A. Witvrouw, M. Wevers, I. De Wolf

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Three different measurement methods for the measurement of the pressure inside empty MEMS packages are demonstrated and discussed. They are based on measurements of capacitance, cap resonance or cap buckling. The capacitance measurement method is shown to be the most sensitive of the three methods for this application, with a pressure resolution of 11mbar.

Original languageEnglish
Title of host publication2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
DOIs
Publication statusPublished - 2012 Nov 19
Event2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012 - Singapore, Singapore
Duration: 2012 Jul 22012 Jul 6

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Other

Other2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012
CountrySingapore
CitySingapore
Period12/7/212/7/6

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Wang, B., Tanaka, S., De Coster, J., Severi, S., Witvrouw, A., Wevers, M., & De Wolf, I. (2012). Comparison of three methods to measure the internal pressure of empty MEMS packages. In 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2012 [6306268] (Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA). https://doi.org/10.1109/IPFA.2012.6306268