TY - JOUR
T1 - Comparative investigation into surface charged multi-walled carbon nanotubes reinforced Cu nanocomposites for interconnect applications
AU - An, Zhonglie
AU - Toda, Masaya
AU - Ono, Takahito
N1 - Funding Information:
Part of this work was performed in the Micro/Nanomachining Research Education Center (MNC) and Micro System Integration Center (μSIC) of Tohoku University. This work was supported by a Grant-in-Aid from the Japanese Ministry of Education, Culture, Sports, Science and Technology , also supported in part by Special Coordination Funds for Promoting Science and Technology , Formation of Innovation Center for Fusion of Advanced Technologies .
Publisher Copyright:
© 2016 Elsevier Ltd. 2016 Elsevier Ltd. All rights reserved.
PY - 2016/6/15
Y1 - 2016/6/15
N2 - We present the electrodeposition of copper (Cu) nanocomposites with a high content of carbon nanotubes (CNTs), and evaluate the mechanical and thermal properties of the nanocomposites. Two kinds of multi-walled CNTs (MWCNTs), thermally-annealed at 1200 °C and 2600 °C, are pretreated in a polyelectrolyte solution to show positive charges on their surfaces and added into a sulfuric Cu electroplating solution. The weight fractions of the MWCNTs in the electroplated composites are 5.3 wt% and 2.8 wt%, respectively. The Young's moduli of the composites are approximately 1.2 times and 1.1 times greater than that of a pure Cu thin film, and the coefficients of thermal expansion (CTEs) of the composites are reduced to be 77% and 85% of the CTE of the pure Cu film, respectively. The mechanical strengthening and thermal expansion reduction are found in the composite. These results show that the nanocomposites would be used instead of Cu thin film for interconnect applications.
AB - We present the electrodeposition of copper (Cu) nanocomposites with a high content of carbon nanotubes (CNTs), and evaluate the mechanical and thermal properties of the nanocomposites. Two kinds of multi-walled CNTs (MWCNTs), thermally-annealed at 1200 °C and 2600 °C, are pretreated in a polyelectrolyte solution to show positive charges on their surfaces and added into a sulfuric Cu electroplating solution. The weight fractions of the MWCNTs in the electroplated composites are 5.3 wt% and 2.8 wt%, respectively. The Young's moduli of the composites are approximately 1.2 times and 1.1 times greater than that of a pure Cu thin film, and the coefficients of thermal expansion (CTEs) of the composites are reduced to be 77% and 85% of the CTE of the pure Cu film, respectively. The mechanical strengthening and thermal expansion reduction are found in the composite. These results show that the nanocomposites would be used instead of Cu thin film for interconnect applications.
KW - A. Metal-matrix composites (MMCs)
KW - A. Thin films
KW - B. Mechanical properties
KW - B. Thermal properties
UR - http://www.scopus.com/inward/record.url?scp=84963537218&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84963537218&partnerID=8YFLogxK
U2 - 10.1016/j.compositesb.2016.03.086
DO - 10.1016/j.compositesb.2016.03.086
M3 - Article
AN - SCOPUS:84963537218
VL - 95
SP - 137
EP - 143
JO - Composites Part B: Engineering
JF - Composites Part B: Engineering
SN - 1359-8368
ER -