Compact triangulation sensor realized by bending wafer with metal hinge

Minoru Sasaki, Satoshi Endou, Masayuki Fujishima, Kazuhiro Hane

Research output: Chapter in Book/Report/Conference proceedingConference contribution


A triangulation distance sensor is constructed bending the wafer with metal hinges. On the Si wafer, elements are pre-aligned at the planer condition using the photolithography. The position sensitive detector (PSD), mirror, and alignment pit for a ball lens are prepared. 3-sensor array is integrated in 20×17×10 mm 3 size. Compared with our previous study using polymer, the metal hinge stabilizes the long-term performance and the process. Optical elements including LD chip are all included on the wafer. The demonstrated measurement range is 18-40 mm.

Original languageEnglish
Title of host publicationMEMS, MOEMS, and Micromachining II
Publication statusPublished - 2006 Aug 9
EventMEMS, MOEMS, and Micromachining II - Strasbourg, France
Duration: 2006 Apr 32006 Apr 4

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherMEMS, MOEMS, and Micromachining II


  • Prealignment
  • Three-dimensional structure
  • Triangulation distance sensor
  • Wafer-bending

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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