Abstract
This paper reports fabrication of CMUT (Capacitive Micromachined Ultrasonic Transducer) based forward looking ultrasonic endoscope using custom designed LTCC (Low Temperature Co-fired Ceramic). Bottom electrodes and cavities are separately patterned on LTCC and SOI wafers, respectively. LTCC wafer is used as bottom substrate (prime wafer) for anodic bonding and ring array and linear array CMUTs transducers are fabricated. To drive transducer arrays electrical connections between transducer arrays and IC (Integrated Circuits) are achieved by LTCC side via accomplished hexagonal shape dicing of CMUT after fabrication. Design, fabrication process and first fabrication results are presented. The advantages of CMUT packaging using LTCC side via compared to previously announced CMUT probe packaging such as TSV (Through Silicon Via) scheme are discussed.
Original language | English |
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Title of host publication | 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 50-53 |
Number of pages | 4 |
ISBN (Electronic) | 9781509019472 |
DOIs | |
Publication status | Published - 2016 Nov 28 |
Event | 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 - Sendai, Japan Duration: 2016 Apr 17 → 2016 Apr 20 |
Other
Other | 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 |
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Country/Territory | Japan |
City | Sendai |
Period | 16/4/17 → 16/4/20 |
Keywords
- anodic bonding
- CMUT
- forward looking
- LTCC
- side via
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Mechanical Engineering
- Mechanics of Materials
- Electronic, Optical and Magnetic Materials