CMUT arrays incorporating anodically bondable LTCC for small diameter ultrasonic endoscope

Fikret Yildiz; Tadao Matsunaga; Yoichi Haga

doi:10.1109/NEMS.2016.7758198

CMUT arrays incorporating anodically bondable LTCC for small diameter ultrasonic endoscope

Fikret Yildiz, Tadao Matsunaga, Yoichi Haga

MEN - Biomedical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper reports fabrication of CMUT (Capacitive Micromachined Ultrasonic Transducer) based forward looking ultrasonic endoscope using custom designed LTCC (Low Temperature Co-fired Ceramic). Bottom electrodes and cavities are separately patterned on LTCC and SOI wafers, respectively. LTCC wafer is used as bottom substrate (prime wafer) for anodic bonding and ring array and linear array CMUTs transducers are fabricated. To drive transducer arrays electrical connections between transducer arrays and IC (Integrated Circuits) are achieved by LTCC side via accomplished hexagonal shape dicing of CMUT after fabrication. Design, fabrication process and first fabrication results are presented. The advantages of CMUT packaging using LTCC side via compared to previously announced CMUT probe packaging such as TSV (Through Silicon Via) scheme are discussed.

Original language	English
Title of host publication	2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	50-53
Number of pages	4
ISBN (Electronic)	9781509019472
DOIs	https://doi.org/10.1109/NEMS.2016.7758198
Publication status	Published - 2016 Nov 28
Event	11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 - Sendai, Japan Duration: 2016 Apr 17 → 2016 Apr 20

Other

Other	11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
Country/Territory	Japan
City	Sendai
Period	16/4/17 → 16/4/20

Keywords

anodic bonding
CMUT
forward looking
LTCC
side via

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Mechanical Engineering
Mechanics of Materials
Electronic, Optical and Magnetic Materials

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10.1109/NEMS.2016.7758198

Cite this

CMUT arrays incorporating anodically bondable LTCC for small diameter ultrasonic endoscope. / Yildiz, Fikret; Matsunaga, Tadao; Haga, Yoichi.

2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 50-53 7758198.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yildiz, F, Matsunaga, T & Haga, Y 2016, CMUT arrays incorporating anodically bondable LTCC for small diameter ultrasonic endoscope. in 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016., 7758198, Institute of Electrical and Electronics Engineers Inc., pp. 50-53, 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Sendai, Japan, 16/4/17. https://doi.org/10.1109/NEMS.2016.7758198

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abstract = "This paper reports fabrication of CMUT (Capacitive Micromachined Ultrasonic Transducer) based forward looking ultrasonic endoscope using custom designed LTCC (Low Temperature Co-fired Ceramic). Bottom electrodes and cavities are separately patterned on LTCC and SOI wafers, respectively. LTCC wafer is used as bottom substrate (prime wafer) for anodic bonding and ring array and linear array CMUTs transducers are fabricated. To drive transducer arrays electrical connections between transducer arrays and IC (Integrated Circuits) are achieved by LTCC side via accomplished hexagonal shape dicing of CMUT after fabrication. Design, fabrication process and first fabrication results are presented. The advantages of CMUT packaging using LTCC side via compared to previously announced CMUT probe packaging such as TSV (Through Silicon Via) scheme are discussed.",

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author = "Fikret Yildiz and Tadao Matsunaga and Yoichi Haga",

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N2 - This paper reports fabrication of CMUT (Capacitive Micromachined Ultrasonic Transducer) based forward looking ultrasonic endoscope using custom designed LTCC (Low Temperature Co-fired Ceramic). Bottom electrodes and cavities are separately patterned on LTCC and SOI wafers, respectively. LTCC wafer is used as bottom substrate (prime wafer) for anodic bonding and ring array and linear array CMUTs transducers are fabricated. To drive transducer arrays electrical connections between transducer arrays and IC (Integrated Circuits) are achieved by LTCC side via accomplished hexagonal shape dicing of CMUT after fabrication. Design, fabrication process and first fabrication results are presented. The advantages of CMUT packaging using LTCC side via compared to previously announced CMUT probe packaging such as TSV (Through Silicon Via) scheme are discussed.

AB - This paper reports fabrication of CMUT (Capacitive Micromachined Ultrasonic Transducer) based forward looking ultrasonic endoscope using custom designed LTCC (Low Temperature Co-fired Ceramic). Bottom electrodes and cavities are separately patterned on LTCC and SOI wafers, respectively. LTCC wafer is used as bottom substrate (prime wafer) for anodic bonding and ring array and linear array CMUTs transducers are fabricated. To drive transducer arrays electrical connections between transducer arrays and IC (Integrated Circuits) are achieved by LTCC side via accomplished hexagonal shape dicing of CMUT after fabrication. Design, fabrication process and first fabrication results are presented. The advantages of CMUT packaging using LTCC side via compared to previously announced CMUT probe packaging such as TSV (Through Silicon Via) scheme are discussed.

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KW - side via

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ER -

CMUT arrays incorporating anodically bondable LTCC for small diameter ultrasonic endoscope

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Keywords

ASJC Scopus subject areas

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