CMUT arrays incorporating anodically bondable LTCC for small diameter ultrasonic endoscope

Fikret Yildiz, Tadao Matsunaga, Yoichi Haga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper reports fabrication of CMUT (Capacitive Micromachined Ultrasonic Transducer) based forward looking ultrasonic endoscope using custom designed LTCC (Low Temperature Co-fired Ceramic). Bottom electrodes and cavities are separately patterned on LTCC and SOI wafers, respectively. LTCC wafer is used as bottom substrate (prime wafer) for anodic bonding and ring array and linear array CMUTs transducers are fabricated. To drive transducer arrays electrical connections between transducer arrays and IC (Integrated Circuits) are achieved by LTCC side via accomplished hexagonal shape dicing of CMUT after fabrication. Design, fabrication process and first fabrication results are presented. The advantages of CMUT packaging using LTCC side via compared to previously announced CMUT probe packaging such as TSV (Through Silicon Via) scheme are discussed.

Original languageEnglish
Title of host publication2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages50-53
Number of pages4
ISBN (Electronic)9781509019472
DOIs
Publication statusPublished - 2016 Nov 28
Event11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 - Sendai, Japan
Duration: 2016 Apr 172016 Apr 20

Other

Other11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
Country/TerritoryJapan
CitySendai
Period16/4/1716/4/20

Keywords

  • anodic bonding
  • CMUT
  • forward looking
  • LTCC
  • side via

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

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