Cladding technique for development of Ag-In-Cd decoupler

M. Teshigawara; M. Harada; S. Saito; K. Kikuchi; H. Kogawa; Y. Ikeda; M. Kawai; H. Kurishita; K. Konashi

doi:10.1016/j.jnucmat.2004.08.036

Cladding technique for development of Ag-In-Cd decoupler

M. Teshigawara, M. Harada, S. Saito, K. Kikuchi, H. Kogawa, Y. Ikeda, M. Kawai, H. Kurishita, K. Konashi

International Research Center for Nuclear Materials Science

Research output: Contribution to journal › Conference article › peer-review

10 Citations (Scopus)

Abstract

To develop a Ag (silver)-In (indium)-Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 1 h, respectively, for small test pieces (φ 22 mm in diam. × 5 mm in height). Especially, a sandwich case (a Ag-In plate with thickness of 0.5 mm between two Ag-Cd plates with thickness of 1.25 mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.

Original language	English
Pages (from-to)	154-162
Number of pages	9
Journal	Journal of Nuclear Materials
Volume	343
Issue number	1-3
DOIs	https://doi.org/10.1016/j.jnucmat.2004.08.036
Publication status	Published - 2005 Aug 1
Event	Proceedings of the 6th International Workshop on Spallation Materials Technology IWSMT-6 - Duration: 2003 Nov 30 → 2003 Dec 5

ASJC Scopus subject areas

Nuclear and High Energy Physics
Materials Science(all)
Nuclear Energy and Engineering

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@article{2fdfcb80597041fcb024c00a2f787a5b,

title = "Cladding technique for development of Ag-In-Cd decoupler",

abstract = "To develop a Ag (silver)-In (indium)-Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 1 h, respectively, for small test pieces (φ 22 mm in diam. × 5 mm in height). Especially, a sandwich case (a Ag-In plate with thickness of 0.5 mm between two Ag-Cd plates with thickness of 1.25 mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.",

author = "M. Teshigawara and M. Harada and S. Saito and K. Kikuchi and H. Kogawa and Y. Ikeda and M. Kawai and H. Kurishita and K. Konashi",

year = "2005",

month = aug,

day = "1",

doi = "10.1016/j.jnucmat.2004.08.036",

language = "English",

volume = "343",

pages = "154--162",

journal = "Journal of Nuclear Materials",

issn = "0022-3115",

publisher = "Elsevier",

number = "1-3",

note = "Proceedings of the 6th International Workshop on Spallation Materials Technology IWSMT-6 ; Conference date: 30-11-2003 Through 05-12-2003",

}

TY - JOUR

T1 - Cladding technique for development of Ag-In-Cd decoupler

AU - Teshigawara, M.

AU - Harada, M.

AU - Saito, S.

AU - Kikuchi, K.

AU - Kogawa, H.

AU - Ikeda, Y.

AU - Kawai, M.

AU - Kurishita, H.

AU - Konashi, K.

PY - 2005/8/1

Y1 - 2005/8/1

N2 - To develop a Ag (silver)-In (indium)-Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 1 h, respectively, for small test pieces (φ 22 mm in diam. × 5 mm in height). Especially, a sandwich case (a Ag-In plate with thickness of 0.5 mm between two Ag-Cd plates with thickness of 1.25 mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.

AB - To develop a Ag (silver)-In (indium)-Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 1 h, respectively, for small test pieces (φ 22 mm in diam. × 5 mm in height). Especially, a sandwich case (a Ag-In plate with thickness of 0.5 mm between two Ag-Cd plates with thickness of 1.25 mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.

UR - http://www.scopus.com/inward/record.url?scp=23744444869&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=23744444869&partnerID=8YFLogxK

U2 - 10.1016/j.jnucmat.2004.08.036

DO - 10.1016/j.jnucmat.2004.08.036

M3 - Conference article

AN - SCOPUS:23744444869

VL - 343

SP - 154

EP - 162

JO - Journal of Nuclear Materials

JF - Journal of Nuclear Materials

SN - 0022-3115

IS - 1-3

T2 - Proceedings of the 6th International Workshop on Spallation Materials Technology IWSMT-6

Y2 - 30 November 2003 through 5 December 2003

ER -

Cladding technique for development of Ag-In-Cd decoupler

Abstract

ASJC Scopus subject areas

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