Abstract
To develop a Ag (silver)-In (indium)-Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803 K, 100 MPa and 1 h, respectively, for small test pieces (φ 22 mm in diam. × 5 mm in height). Especially, a sandwich case (a Ag-In plate with thickness of 0.5 mm between two Ag-Cd plates with thickness of 1.25 mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30 MPa, which is higher than the design stress in our application.
Original language | English |
---|---|
Pages (from-to) | 154-162 |
Number of pages | 9 |
Journal | Journal of Nuclear Materials |
Volume | 343 |
Issue number | 1-3 |
DOIs | |
Publication status | Published - 2005 Aug 1 |
Event | Proceedings of the 6th International Workshop on Spallation Materials Technology IWSMT-6 - Duration: 2003 Nov 30 → 2003 Dec 5 |
ASJC Scopus subject areas
- Nuclear and High Energy Physics
- Materials Science(all)
- Nuclear Energy and Engineering