Chip-level TSV integration for rapid prototyping of 3D system LSIs

Kazuyuki Hozawa, Futoshi Furuta, Yuko Hanaoka, Mayu Aoki, Kenichi Takeda, Katsuyuki Sakuma, Kanuku Ri, Takafumi Fukushima, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Engineering & Materials Science