Chip-level-microassembly Comb-drive XYZ-microstage with Large Displacements and Low Crosstalk

Gaopeng Xue, Masaya Toda, Xinghui Li, Takahito Ono

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a chip-level-microassembly comb-drive XYZ-microstage with large displacements and low crosstalk for the applications of scanning force microscope at cryogenic environment. The three-dimensional comb-drive XYZ-microstage, with no affection to the thermal variation, was accurately and orderly constructed with three components of a comb-drive XY-microstage for in-plane actuation, two comb-drive Z-actuators for out-of-plane actuation, and a base substrate using a chip-level-microassembly technology. This configuration can overcome the out-of-plane stroke-space limitation of conventional monolithic-wafer-based XYZ-microstages, and the crosstalk movements resulting from the coupling connection between in-plane and out-of-plane actuation units can be avoided. Additionally, we further conducted two aspects of designing the decoupling-motion structure and constraining the capacitance-decoupling crosstalk, to achieve low-crosstalk movements in the in-plane actuation unit. The folded-flexure springs with high stiffness were adopted to enhance the lateral stability of movable combs and improve the range of achievable strokes. Finally, the fabricated comb-drive XYZ-micro stage, as a promising three-dimensional scanner, was capable of providing large displacements of 28.3 μm into +X direction, 20.9 μm into -X direction, 5.8 μm into +Y direction, 22.1 μm into -Y direction, and 50.5 μm into Z direction, respectively.

Original languageEnglish
Title of host publicationProceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages43-46
Number of pages4
ISBN (Electronic)9781665419413
DOIs
Publication statusPublished - 2021 Apr 25
Event16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021 - Xiamen, China
Duration: 2021 Apr 252021 Apr 29

Publication series

NameProceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021

Conference

Conference16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
Country/TerritoryChina
CityXiamen
Period21/4/2521/4/29

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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