Chip-interleaved multi-rate CDMA with 2-dimensional OVSF spreading

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Chip interleaving technique has been proposed for DS-CDMA to eliminate the multiple-access interference (MAI). In this paper, we develop this technique to provide the single- or multicarrier CDMA with flexible low-to-high bit rate transmission by jointly using 2-dimensional (2D) OVSF spreading and chip interleaving for quasi-synchronous uplink transmissions in time- and frequency-selective fading channels. Through appropriate design of 2D spreading code assignment, not only the maximum time- and frequency-domain diversity can be achieved but also users are equipped with multi-rate services. The complexity of receivers is greatly reduced since single-user frequency-domain equalization (FDE) based on the MMSE criterion can be applied for signal detection. Computer simulation results show that the multi-rate transmission is possible for the 2D OVSF spread/chip-interleaved CDMA uplink and the bit error rate (BER) performance with turbo coding is very robust against Doppler spread.

Original languageEnglish
Title of host publication2006 IEEE 63rd Vehicular Technology Conference, VTC 2006-Spring - Proceedings
Pages1767-1771
Number of pages5
Volume4
Publication statusPublished - 2006 Dec 1
Event2006 IEEE 63rd Vehicular Technology Conference, VTC 2006-Spring - Melbourne, Australia
Duration: 2006 May 72006 Jul 10

Other

Other2006 IEEE 63rd Vehicular Technology Conference, VTC 2006-Spring
CountryAustralia
CityMelbourne
Period06/5/706/7/10

Keywords

  • 2-dimensional OVSF spreading
  • CDMA
  • Chip interleaving
  • Multi-rate
  • Uplink transmission

ASJC Scopus subject areas

  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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  • Cite this

    Liu, L., & Adachi, F. (2006). Chip-interleaved multi-rate CDMA with 2-dimensional OVSF spreading. In 2006 IEEE 63rd Vehicular Technology Conference, VTC 2006-Spring - Proceedings (Vol. 4, pp. 1767-1771). [1683150]