Chip-based hetero-integration technology for high-performance 3D stacked image sensor

Yuki Ohara; Kang Wook Lee; Koji Kiyoyama; Shigehide Konno; Yutaka Sato; Shuichi Watanabe; Atsushi Yabata; Harufumi Kobayashi; Tadashi Kamada; Jichel Bea; Mariappan Murugesan; Hiroyuki Hashimoto; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi

doi:10.1109/ICSJ.2012.6523452

Chip-based hetero-integration technology for high-performance 3D stacked image sensor

Yuki Ohara, Kang Wook Lee, Koji Kiyoyama, Shigehide Konno, Yutaka Sato, Shuichi Watanabe, Atsushi Yabata, Harufumi Kobayashi, Tadashi Kamada, Jichel Bea, Mariappan Murugesan, Hiroyuki Hashimoto, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

We have developed a 3D-stacked image sensor chip composed of CMOS image sensor (CIS) layer, correlated double sampling circuit (CDS) layer, and analog-to-digital converter (ADC) array layer using the chip-based 3D heterogeneous integration technology. Three kinds of chips, CIS chip, CDS chip, and ADC chip, which were fabricated by different technologies, are processed and stacked vertically to form a prototype 3D-stacked image sensor. Through-Si vias (TSVs) and metal micro-bumps are formed in chip-level before stacking. The fundamental characteristics are evaluated in the fabricated prototype 3D-stacked image sensor.

Original language	English
Title of host publication	2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
DOIs	https://doi.org/10.1109/ICSJ.2012.6523452
Publication status	Published - 2012 Dec 1
Event	2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012 - Kyoto, Japan Duration: 2012 Dec 10 → 2012 Dec 12

Publication series

Name	2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012

Other

Other	2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
Country	Japan
City	Kyoto
Period	12/12/10 → 12/12/12

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/ICSJ.2012.6523452

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Ohara, Y., Lee, K. W., Kiyoyama, K., Konno, S., Sato, Y., Watanabe, S., Yabata, A., Kobayashi, H., Kamada, T., Bea, J., Murugesan, M., Hashimoto, H., Fukushima, T., Tanaka, T., & Koyanagi, M. (2012). Chip-based hetero-integration technology for high-performance 3D stacked image sensor. In 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012 [6523452] (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012). https://doi.org/10.1109/ICSJ.2012.6523452

Chip-based hetero-integration technology for high-performance 3D stacked image sensor. / Ohara, Yuki; Lee, Kang Wook; Kiyoyama, Koji; Konno, Shigehide; Sato, Yutaka; Watanabe, Shuichi; Yabata, Atsushi; Kobayashi, Harufumi; Kamada, Tadashi; Bea, Jichel; Murugesan, Mariappan; Hashimoto, Hiroyuki; Fukushima, Takafumi ; Tanaka, Tetsu; Koyanagi, Mitsumasa.

2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012. 2012. 6523452 (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ohara, Y, Lee, KW, Kiyoyama, K, Konno, S, Sato, Y, Watanabe, S, Yabata, A, Kobayashi, H, Kamada, T, Bea, J, Murugesan, M, Hashimoto, H, Fukushima, T , Tanaka, T & Koyanagi, M 2012, Chip-based hetero-integration technology for high-performance 3D stacked image sensor. in 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012., 6523452, 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012, 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012, Kyoto, Japan, 12/12/10. https://doi.org/10.1109/ICSJ.2012.6523452

Ohara, Yuki ; Lee, Kang Wook ; Kiyoyama, Koji ; Konno, Shigehide ; Sato, Yutaka ; Watanabe, Shuichi ; Yabata, Atsushi ; Kobayashi, Harufumi ; Kamada, Tadashi ; Bea, Jichel ; Murugesan, Mariappan ; Hashimoto, Hiroyuki ; Fukushima, Takafumi ; Tanaka, Tetsu ; Koyanagi, Mitsumasa. / Chip-based hetero-integration technology for high-performance 3D stacked image sensor. 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012. 2012. (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012).

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AU - Watanabe, Shuichi

AU - Yabata, Atsushi

AU - Kobayashi, Harufumi

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AU - Bea, Jichel

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