Chemical mechanical polishing mechanisms for gallium nitride: Quantum chemical molecular dynamics simulations

Kentaro Kawaguchi, Takehiro Aizawa, Yuji Higuchi, Nobuki Ozawa, Momoji Kubo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We developed a chemical mechanical polishing (CMP) simulator based on tight-binding quantum chemical molecular dynamics method and applied it to gallium nitride (GaN) CMP process. We successfully clarified the chemical reaction dynamics at the friction interface between the GaN substrate and an abrasive grain in pure water; surface-adsorbed H2O molecules, OH groups, and H atoms are generated by the adsorption and dissociation of water on the GaN surface. Our developed CMP simulator is capable of predicting the CMP processes controlled by chemical reactions.

Original languageEnglish
Title of host publicationICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages39-41
Number of pages3
ISBN (Electronic)9781479955565
DOIs
Publication statusPublished - 2015 Jan 20
Event11th International Conference on Planarization/CMP Technology, ICPT 2014 - Kobe, Japan
Duration: 2014 Nov 192014 Nov 21

Publication series

NameICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014

Other

Other11th International Conference on Planarization/CMP Technology, ICPT 2014
CountryJapan
CityKobe
Period14/11/1914/11/21

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

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    Kawaguchi, K., Aizawa, T., Higuchi, Y., Ozawa, N., & Kubo, M. (2015). Chemical mechanical polishing mechanisms for gallium nitride: Quantum chemical molecular dynamics simulations. In ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014 (pp. 39-41). [7017241] (ICPT 2014 - Proceedings of International Conference on Planarization/CMP Technology 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICPT.2014.7017241