Charge-Trap-Free Polymer-Liner Through-Silicon Vias for Reliability Improvement of 3D ICs

Hisashi Kino, Sungho Lee, Yohei Sugawara, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Through-silicon-via (TSV) with polymer liner has attracted considerable attention because a polymer liner has low dielectric constant and good step coverage along the TSV surface, and it can suppress the TSV-induced stress. A polyimide (PI) is used as the polymer liner of TSV. However, there is a modulation of the parasitic capacitance present between TSV metal and Si substrate due to its high polar character. Therefore, in this paper, we propose the deployment of benzocyclobutene (BCB) and polybenzoxazole (PBO) which consists of no-polar groups as the polymer-liner material of TSV for minimizing the capacitance modulation. In this study, a metal-insulator-semiconductor capacitor with blind TSV structures with PI, BCB or PBO liners were fabricated and evaluated. In the case of BCB and PBO liners, remarkable hysteresis suppressions of the C-V curves was observed as compared to that of the PI liner. These results indicate that polar character is one of the most important characters for suppression of the capacitance modulation around TSVs and the detrapped-charge-induced signal noise. Then, BCB and PBO is a promising liner material of TSV for realizing highperformance and high-reliability three-dimensional stacked ICs.

Original languageEnglish
Title of host publication2018 IEEE International Interconnect Technology Conference, IITC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages135-137
Number of pages3
ISBN (Print)9781538643372
DOIs
Publication statusPublished - 2018 Aug 8
Event2018 IEEE International Interconnect Technology Conference, IITC 2018 - Santa Clara, United States
Duration: 2018 Jun 42018 Jun 7

Publication series

Name2018 IEEE International Interconnect Technology Conference, IITC 2018

Other

Other2018 IEEE International Interconnect Technology Conference, IITC 2018
Country/TerritoryUnited States
CitySanta Clara
Period18/6/418/6/7

Keywords

  • 3D-IC
  • BCB
  • Charge trap
  • PBO
  • Polyimide
  • Polymer liner
  • TSV

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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