Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs

Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We have fabricated microbump daisy chains with a low-height solder thickness of 2.5 μm in order to evaluate flip-chip bonding capabilities. Electrical characteristics of the bonded microbumps in three-dimensionally stacked chips were compared between a very thin non-conductive film (NCF) and capillary underfill (CUF). The resulting I-V behaviors showed that the resistance of the daisy chain with the NCF was lower than that with the CUF, inDICating that the low-height solder microbumps with combination of the thin NCF can be a promising candidate for future fine-pitch inter-chip connection in 3DICs.

Original languageEnglish
Title of host publicationIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728148700
DOIs
Publication statusPublished - 2019 Oct
Event2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 - Sendai, Japan
Duration: 2019 Oct 82019 Oct 10

Publication series

NameIEEE 2019 International 3D Systems Integration Conference, 3DIC 2019

Conference

Conference2019 IEEE International 3D Systems Integration Conference, 3DIC 2019
CountryJapan
CitySendai
Period19/10/819/10/10

Keywords

  • 3DIC
  • Flip-chip bonding
  • NCF
  • microbump

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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