@inproceedings{a128092478fe4054958f8a0d13451606,
title = "Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs",
abstract = "We have fabricated microbump daisy chains with a low-height solder thickness of 2.5 μm in order to evaluate flip-chip bonding capabilities. Electrical characteristics of the bonded microbumps in three-dimensionally stacked chips were compared between a very thin non-conductive film (NCF) and capillary underfill (CUF). The resulting I-V behaviors showed that the resistance of the daisy chain with the NCF was lower than that with the CUF, inDICating that the low-height solder microbumps with combination of the thin NCF can be a promising candidate for future fine-pitch inter-chip connection in 3DICs.",
keywords = "3DIC, Flip-chip bonding, NCF, microbump",
author = "Yuki Miwa and Sungho Lee and Rui Liang and Kousei Kumahara and Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka",
note = "Funding Information: ACKNOWLEDGMENT This work was supported by JSPS KAKENHI Grant Number JP18H04159. We would like to acknowledge Dexerials for their material support.; 2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 ; Conference date: 08-10-2019 Through 10-10-2019",
year = "2019",
month = oct,
doi = "10.1109/3DIC48104.2019.9058841",
language = "English",
series = "IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019",
}