Characterisation of the interdigitated electrode array with tantalum silicide electrodes separated by insulating barriers

Andrey Bratov, Natalia Abramova, Javier Ramon A., Angel Merlos, Francisco Sánchez-Baeza, Maria Pilar Marco, Carlos Domínguez

    Research output: Contribution to journalArticle

    27 Citations (Scopus)

    Abstract

    A novel design of an interdigitated electrode array impedimetric sensor is proposed with electrode digits separated by an insulating barrier. This configuration results in that the major part of the electric current between electrodes follows close to the surface of the barrier and not through the solution thus permitting to enhance the sensitivity to possible chemical reactions on its surface. As a model system the effect of electrostatically assembled polyelectrolyte layers deposited using layer-by-layer method on the sensor impedance was studied. The sensitivity of the devices depends on the barrier height and is considerably enhanced comparing to conventional flat sensor structures. Devices may be used as a transducer for direct label-free biosensor development.

    Original languageEnglish
    Pages (from-to)1621-1624
    Number of pages4
    JournalElectrochemistry Communications
    Volume10
    Issue number10
    DOIs
    Publication statusPublished - 2008 Oct 1

    Keywords

    • Biosensor
    • Impedance
    • Iterdigitated electrode array
    • Layer-by-layer
    • Sensor

    ASJC Scopus subject areas

    • Electrochemistry

    Fingerprint Dive into the research topics of 'Characterisation of the interdigitated electrode array with tantalum silicide electrodes separated by insulating barriers'. Together they form a unique fingerprint.

  • Cite this

    Bratov, A., Abramova, N., Ramon A., J., Merlos, A., Sánchez-Baeza, F., Marco, M. P., & Domínguez, C. (2008). Characterisation of the interdigitated electrode array with tantalum silicide electrodes separated by insulating barriers. Electrochemistry Communications, 10(10), 1621-1624. https://doi.org/10.1016/j.elecom.2008.07.037