Change in electrical resistivity associated with the glass transition in a continuously cooled Pd₄₀Cu₃₀Ni₁₀P₂₀ melt

We report a reversible change in electrical resistivity accompanied with the glass transition (glass transition temperature T_g = 570 K) in a Pd₄₀Cu₃₀Ni₁₀P₂₀ bulk glass. The bulk glass with a diameter of about 5 mm and length of 30 mm was produced at a maximum cooling rate of 1.2 K/s. This bulk glass showed a negative temperature coefficient of resistivity -0.81×10^-4 K^-1, at room temperature, -4.17×10^-4 K^-1 in the supercooled liquid region, and -2.75×10^-4 K^-1 in the liquid state. The undercooled liquid alloy beyond eutectic temperature T_m = 804 K did not show the onset of crystallization until room temperature. The behavior of resistivity around T_g was in accordance with the heating to and cooling from the melt. This suggests that the amorphous structure might vary reversibly according to the glass transition in the present glass.