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Challenges of high-robustness self-assembly with Cu/Sn-Ag microbump bonding for die-to-wafer 3D integration
Taku SuZuki, Kazushi Asami, Yasuhiro Kitamura, Takafumi Fukushima, Chisato Nagai, Jichoel Bea, Yutaka Sato, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
10
Citations
(Scopus)