Challenges of high-robustness self-assembly with Cu/Sn-Ag microbump bonding for die-to-wafer 3D integration

Taku SuZuki, Kazushi Asami, Yasuhiro Kitamura, Takafumi Fukushima, Chisato Nagai, Jichoru Be, Yutaka Sato, Mariappan Murugesan, Kanuku Ri, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

We demonstrated surface tension-driven self-assembly of chips with Cu/Sn-Ag microbumps in order to satisfy requirements for both high throughput and high alignment accuracy toward 3D system integration. The chips were singulated with different dicing methods: standard single-cut, precise single-cut, and modified step-cut. The alignment accuracies were compared among the three methods. The chips obtained by modified step-cut were precisely aligned within approximately 2 μm and comparable to that obtained by precise single-cut. By optimizing liquid volumes, the step-cut chips having Cu/Sn-Ag microbumps were accurately self-assembled irrespective of microbump densities. The self-assembled chips were successfully bonded at 280°C by thermal compression. The Cu/Sn-Ag daisy chains indicated good electrical characteristics with a resistance of 35 mω/joint.

Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages342-347
Number of pages6
ISBN (Electronic)9781479986095
DOIs
Publication statusPublished - 2015 Jul 15
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: 2015 May 262015 May 29

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2015-July
ISSN (Print)0569-5503

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
CountryUnited States
CitySan Diego
Period15/5/2615/5/29

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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