Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid from 2005. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configurations are introduced for fine-pitch interconnect formation. In addition, 'non-transfer stacking', in other word, flip-chip self-assembly and 'transfer stacking' called reconfigure-wafer-to-wafer using SAE (Self-Assembly and Electrostatic) carrier are explained.

Original languageEnglish
Title of host publicationMARSS 2018 - International Conference on Manipulation, Automation and Robotics at Small Scales
EditorsSergej Fatikow, Sinan Haliyo, Fumihito Arai, Albert Sill
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538648414
DOIs
Publication statusPublished - 2018 Oct 3
Event3rd International Conference on Manipulation, Automation and Robotics at Small Scales, MARSS 2018 - Nagoya, Japan
Duration: 2018 Jul 42018 Jul 8

Publication series

NameMARSS 2018 - International Conference on Manipulation, Automation and Robotics at Small Scales

Other

Other3rd International Conference on Manipulation, Automation and Robotics at Small Scales, MARSS 2018
CountryJapan
CityNagoya
Period18/7/418/7/8

Keywords

  • 3D and heterogeneous system integration
  • chip-to-wafer bonding
  • massively parallel capillary self-assembly

ASJC Scopus subject areas

  • Artificial Intelligence
  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Control and Optimization

Fingerprint Dive into the research topics of 'Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies'. Together they form a unique fingerprint.

Cite this