Capacitive micromacliiiied ultrasonic transducers using anodically bondable ceramic wafer with through-wafer via

Misaki Hiroshima, Tadao Matsunaga, Takashi Mineta, Yoichi Haga

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Tins paper desenbes the design and experimental results of C'MUTs (Capacitive Mieromachined Ultrasonic Transducers) using an anodically bondable LTCC (Low Temperature C'o-fired Ceramics) wafer. Electrical connection of the C'MUTs top electrode and the LTCC via were successfully performed at a tune of anodic bondmg by forming Au bump on the electrode. The vibration characteristics of the membrane were measured by a laser Doppler \ibrometer both in the atmosphere and in the water. Ultrasonic pressure signal of CMUTs arrays was measured using hydrophone.

Original languageEnglish
Pages (from-to)333-337
Number of pages5
JournalIEEJ Transactions on Sensors and Micromachines
Volume134
Issue number10
DOIs
Publication statusPublished - 2014 Jan 1

Keywords

  • Anodic bondmg
  • CMUTs (capacitive micromacliiiied ultrasonic transducers)
  • LTCC substrate

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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