By an improved drying method

Masato Ohtsu, Kazuyuki Minami, Masayoshi Esashi

Research output: Contribution to conferencePaperpeer-review

11 Citations (Scopus)

Abstract

Fabrication of a silicon thin beam structure bonded to a glass with a very narrow gap is needed to make highly sensitive sensors. In fabrication process of the thin beam structure, rinsing and drying process using Fluorinert, which indicates small surface tension, has been investigated to reduce stiction and collapse. Drying after rinsing in ethyl ether and Fluorinert successively was found effective to keep the silicon wafer surface clean. With this method, glass could be bonded to the silicon wafer and packaged thin beam structures were obtained. The narrow achieved gap between silicon thin (1.2 μm) beam and bonded glass was 0.7 μm. Owing to the improvement of the wafer holder and the interferometric thickness measurement, silicon thin beam of 0.27 μm in thickness was achieved.

Original languageEnglish
Pages228-233
Number of pages6
Publication statusPublished - 1996 Jan 1
EventProceedings of the 1995 9th Annual International Workshop on Micro Electro Mechanical Systems - San Diego, CA, USA
Duration: 1996 Feb 111996 Feb 15

Other

OtherProceedings of the 1995 9th Annual International Workshop on Micro Electro Mechanical Systems
CitySan Diego, CA, USA
Period96/2/1196/2/15

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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