Bump formation technique for multi-chip module with optical interconnection

H. Kurino; R. Nitobe; H. Kuribara; Y. Yamada; T. Fukushima; J. Shim; M. Koyanagi

Bump formation technique for multi-chip module with optical interconnection

H. Kurino, R. Nitobe, H. Kuribara, Y. Yamada, T. Fukushima, J. Shim, M. Koyanagi

Research output: Contribution to conference › Paper › peer-review

Abstract

We have proposed a multi-chip module with optical interconnection which has several aluminum micro mirrors in it. In this work, we improved copper bump formation process and obtained excellent copper bumps with low resistance and high yield.

Original language	English
Pages	442-444
Number of pages	3
Publication status	Published - 2004 Dec 1
Event	3rd International Conference on Semiconductor Technology, ISTC2004 - Shanghai, China Duration: 2004 Sep 15 → 2004 Sep 17

Other

Other	3rd International Conference on Semiconductor Technology, ISTC2004
Country/Territory	China
City	Shanghai
Period	04/9/15 → 04/9/17

ASJC Scopus subject areas

Engineering(all)

Cite this

@conference{f93f145126a943729d804e4aa458b40c,

title = "Bump formation technique for multi-chip module with optical interconnection",

abstract = "We have proposed a multi-chip module with optical interconnection which has several aluminum micro mirrors in it. In this work, we improved copper bump formation process and obtained excellent copper bumps with low resistance and high yield.",

author = "H. Kurino and R. Nitobe and H. Kuribara and Y. Yamada and T. Fukushima and J. Shim and M. Koyanagi",

year = "2004",

month = dec,

day = "1",

language = "English",

pages = "442--444",

note = "3rd International Conference on Semiconductor Technology, ISTC2004 ; Conference date: 15-09-2004 Through 17-09-2004",

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TY - CONF

T1 - Bump formation technique for multi-chip module with optical interconnection

AU - Kurino, H.

AU - Nitobe, R.

AU - Kuribara, H.

AU - Yamada, Y.

AU - Fukushima, T.

AU - Shim, J.

AU - Koyanagi, M.

PY - 2004/12/1

Y1 - 2004/12/1

N2 - We have proposed a multi-chip module with optical interconnection which has several aluminum micro mirrors in it. In this work, we improved copper bump formation process and obtained excellent copper bumps with low resistance and high yield.

AB - We have proposed a multi-chip module with optical interconnection which has several aluminum micro mirrors in it. In this work, we improved copper bump formation process and obtained excellent copper bumps with low resistance and high yield.

UR - http://www.scopus.com/inward/record.url?scp=28844477183&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=28844477183&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:28844477183

SP - 442

EP - 444

T2 - 3rd International Conference on Semiconductor Technology, ISTC2004

Y2 - 15 September 2004 through 17 September 2004

ER -

Bump formation technique for multi-chip module with optical interconnection

Abstract

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ASJC Scopus subject areas

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