Bump formation technique for multi-chip module with optical interconnection

H. Kurino, R. Nitobe, H. Kuribara, Y. Yamada, T. Fukushima, J. Shim, M. Koyanagi

Research output: Contribution to conferencePaperpeer-review

Abstract

We have proposed a multi-chip module with optical interconnection which has several aluminum micro mirrors in it. In this work, we improved copper bump formation process and obtained excellent copper bumps with low resistance and high yield.

Original languageEnglish
Pages442-444
Number of pages3
Publication statusPublished - 2004 Dec 1
Event3rd International Conference on Semiconductor Technology, ISTC2004 - Shanghai, China
Duration: 2004 Sep 152004 Sep 17

Other

Other3rd International Conference on Semiconductor Technology, ISTC2004
CountryChina
CityShanghai
Period04/9/1504/9/17

ASJC Scopus subject areas

  • Engineering(all)

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