We have proposed a multi-chip module with optical interconnection which has several aluminum micro mirrors in it. In this work, we improved copper bump formation process and obtained excellent copper bumps with low resistance and high yield.
|Number of pages||3|
|Publication status||Published - 2004 Dec 1|
|Event||3rd International Conference on Semiconductor Technology, ISTC2004 - Shanghai, China|
Duration: 2004 Sep 15 → 2004 Sep 17
|Other||3rd International Conference on Semiconductor Technology, ISTC2004|
|Period||04/9/15 → 04/9/17|
ASJC Scopus subject areas