Bonding of a Si microstructure using field-assisted glass melting

Hironori Seki, Takahito Ono, Yusuke Kawai, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

This paper reports a novel micro-bonding process based on field-assisted glass melting at room temperature. The phenomenon of local melting of a glass is also investigated. A cantilevered structure with a sharp tip is contacted with a metal-coated glass, and a voltage of few volts is applied between the tip and the metal thin film. As a result, the glass in the vicinity of the tip is melted. It is considered that a high electric field at the tip diffuses the metal atoms into the glass and forms ionic liquid. This is only observed on the glass coated with a thin Cr film among Al, Au, Cr and Ti thin films. This micro-melting process is applied to the assembling of silicon microstructures on a glass substrate. Cantilevered silicon structures with a tip and a microstructure are fabricated by microfabrication technology. During this melting reaction, external force is applied and the tip gets buried; as a result, the cantilever is bonded with the glass substrate. The support of the cantilever beam is mechanically broken, which can leave the microstructure on the glass substrate.

Original languageEnglish
Article number085003
JournalJournal of Micromechanics and Microengineering
Volume18
Issue number8
DOIs
Publication statusPublished - 2008 Aug 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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