Bond characterization in very high power ultrasonic additive manufacturing

M. R. Sriraman, Hiromichi Fujii, Matt Gonser, S. S. Babu, Matt Short

Research output: Contribution to conferencePaperpeer-review

6 Citations (Scopus)

Abstract

Solid parts were produced by Very High Power Ultrasonic Additive Manufacturing (VHP-UAM) at room temperature using 150 μm thick tapes of 6061 aluminum and 110 copper alloys. Processing was done at 20 kHz frequency over a range of parameters (26 -36 μm vibration amplitude, 5.6 - 6.7 kN normal force, and 30.5 - 35.5 mm/s travel speed). Softening of materials (up to about 14% in 6061 Al and 23% in 110 Cu) was noted facilitating enhanced plastic flow and a reduction in interfacial voids. Evolution of fine recrystallized grains (0.3-4 μm in 6061 Al and 0.3-10 μm in 110 Cu) from an initial coarser grain structure (up to 8 μm in 6061 Al and 25 μm in Cu) was observed at the build interface regions. Bonding between layers in both materials seems to have occurred by dynamic recrystallization and movement of grain boundaries across the interface. The energy required for the above physical processes is derived from interfacial adiabatic plastic deformation heating.

Original languageEnglish
Pages372-382
Number of pages11
Publication statusPublished - 2010
Event21st Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, SFF 2010 - Austin, TX, United States
Duration: 2010 Aug 92010 Aug 11

Other

Other21st Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, SFF 2010
Country/TerritoryUnited States
CityAustin, TX
Period10/8/910/8/11

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Fingerprint

Dive into the research topics of 'Bond characterization in very high power ultrasonic additive manufacturing'. Together they form a unique fingerprint.

Cite this