Body centered cubic buffer layers for enhanced lateral grain growth of Co/Cu multilayers

Masakiyo Tsunoda, Daisuke Takahashi, Migaku Takahashi

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

The effect of body centered cubic (bcc) solid solution buffer layers (BL) on metallurgical microstructure was investigated for enhanced lateral grain growth of Co/Cu multilayers. A guiding principle for the material research for BLs was deduced to realize flat interfaces with large lateral grain size in multilayers. It was stated that the difference between the surface energy of BL and the interfacial energy should agree with the surface energy of the layer first deposited on the BL.

Original languageEnglish
Pages (from-to)6513-6515
Number of pages3
JournalJournal of Applied Physics
Volume93
Issue number10 2
DOIs
Publication statusPublished - 2003 May 15

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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