Bi-base composite solders for mounting power semiconductor devices

Yoshikazu Takaku, Ikuo Ohnuma, Yasushi Yamada, Yuji Yagi, Yuji Nishibe, Yuji Sutou, Ryosuke Kainuma, Kiyohito Ishida

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

A novel Bi-base solder for mounting semiconductor power devices on inverters used in hybrid and fuel-cell vehicles was studied. The solder consists of Bi-base matrix (m.p. (melting point)=270°C), which facilitates high-temperature soldering, and dispersion particles of a Cu-Al-Mn alloy, whose thermoelastic martensitic microstructure is expected to relax the thermal stress. The tensile strength of the developed solders was found to be remarkably improved compared with that of pure Bi. Results of tensile tests at elevated temperatures showed greater elongation and lower strength than those at room temperature. However, sufficient tensile strength was still remained at 195°C. Effects of the CTE (coefficient of thermal expansion) and the surface substance of chips and substrates on the IMC (intermetallic compound) formation and thermal cycling properties were investigated. Even after 1983 thermal cycles between -40°C and 200°C, neither intermetallic compounds nor cracks were observed at the Cu/Bi-base solder interfaces in the CTE matched samples.

Original languageEnglish
Pages (from-to)141-146
Number of pages6
JournalJournal of Japan Institute of Electronics Packaging
Volume11
Issue number2
DOIs
Publication statusPublished - 2008 Mar

Keywords

  • Bi-Base Composite Solder
  • CuAIMn Powder
  • IMC (intermetallic compound)
  • Mechanical Property
  • Thermal Cycling Test

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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