Bakable silicon pneumatic microvalve

D. Y. Sim, T. Kurabayashi, M. Esashi

Research output: Contribution to conferencePaperpeer-review

6 Citations (Scopus)

Abstract

A new bakable silicon pneumatic microvalve has been developed for advanced semiconductor fabrication processes. Two micromachined glass-silicon structures were bonded together by Au-Si eutectic bonding. This microvalve was further bonded to Kovar block which is welded to stainless steel tubes. The gas flow rate could be controlled from 0.1 sccm to 35 sccm, at 25approx.120°C.

Original languageEnglish
Pages280-283
Number of pages4
Publication statusPublished - 1995 Dec 1
EventProceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Part 1 (of 2) - Stockholm, Sweden
Duration: 1995 Jun 251995 Jun 29

Other

OtherProceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Part 1 (of 2)
CityStockholm, Sweden
Period95/6/2595/6/29

ASJC Scopus subject areas

  • Engineering(all)

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