Abstract
A new bakable silicon pneumatic microvalve has been developed for advanced semiconductor fabrication processes. Two micromachined glass-silicon structures were bonded together by Au-Si eutectic bonding. This microvalve was further bonded to Kovar block which is welded to stainless steel tubes. The gas flow rate could be controlled from 0.1 sccm to 35 sccm, at 25approx.120°C.
| Original language | English |
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| Pages | 280-283 |
| Number of pages | 4 |
| Publication status | Published - 1995 Dec 1 |
| Event | Proceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Part 1 (of 2) - Stockholm, Sweden Duration: 1995 Jun 25 → 1995 Jun 29 |
Other
| Other | Proceedings of the 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Part 1 (of 2) |
|---|---|
| City | Stockholm, Sweden |
| Period | 95/6/25 → 95/6/29 |
ASJC Scopus subject areas
- Engineering(all)