Backside damage introduced by cavitating jet for gettering

Hiroyuki Kumano, Hitoshi Soyama, Masumi Saka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Gettering is very important technique for IC manufacturing. Backside damage is one of the gettering techniques. A method of introducing backside damage into silicon wafer for gettering, which utilizes cavitation impacts, is presented. Because intensity of cavitation impacts can easily be controlled, cavitation impacts caused by a cavitating jet were used. The impacts of cavitation bubble collapses were controlled by injection pressure and distance from a nozzle to the silicon wafer surface. The surface of silicon wafer treated by the cavitating jet was demonstrated. On the surface of silicon wafer treated by the cavitating jet followed by heat treatment, oxidation-induced stacking faults that are effective as gettering sites were observed. This fact means that cavitating jet can be used to introduce backside damage for gettering. The distribution of impacts caused by cavitation bubble collapses was measured to estimate magnitude of impact to introduce suitable damage. In order to expand exposed area, the surface of silicon wafer was scanned by moving the nozzle. X-ray diffraction from exposed area was measured compared with that from not exposed area. The diffractive angle on exposed area was different from not exposed area.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging
Pages1471-1476
Number of pages6
Publication statusPublished - 2001 Dec 1
EventAdvances in Electronic Packaging - Kauai, Hi, United States
Duration: 2001 Jul 82001 Jul 13

Publication series

NameAdvances in Electronic Packaging
Volume3

Other

OtherAdvances in Electronic Packaging
CountryUnited States
CityKauai, Hi
Period01/7/801/7/13

Keywords

  • Backside Damage
  • Cavitation
  • Gettering
  • Jet
  • X-ray

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering

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  • Cite this

    Kumano, H., Soyama, H., & Saka, M. (2001). Backside damage introduced by cavitating jet for gettering. In Advances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging (pp. 1471-1476). (Advances in Electronic Packaging; Vol. 3).