AUSN solder vacuum packaging using melted solder floodgates and laser-activated non-evaporable getters for SIC diaphragm anticorrosive vacuum sensors

Shuji Tanaka, Yutaka Honjoya, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

Versatile wafer-level vacuum packaging technology using screen-printed AuSn eutectic solder was developed and applied to a SiC diaphragm anticorrosive vacuum sensor. Thin film Ti/SiO2 "floodgates" were used to prevent melted AuSn solder from flowing into microstructures, e.g. capacitive gaps. After vacuum packaging, a non-evaporable getter (NEG), which chemically absorbs residual gas, was activated by Nd:YAG laser. In comparison to other wafer-level vacuum packaging technologies, the developed one establishes electrical connections and feedthroughs simultaneously, and is tolerant to surface roughness, surface contamination and wafer waviness.

Original languageEnglish
Title of host publicationMEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
Pages492-495
Number of pages4
DOIs
Publication statusPublished - 2010
Event23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010 - Hong Kong, China
Duration: 2010 Jan 242010 Jan 28

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
CountryChina
CityHong Kong
Period10/1/2410/1/28

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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