Au/SiO2 hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors

Yuki Honda; Kei Hagiwara; Masahide Goto; Toshihisa Watabe; Masakazu Nanba; Yoshinori Iguchi; Takuya Saraya; Masaharu Kobayashi; Hiroshi Toshiyoshi; Eiji Higurashi; Toshiro Hiramoto

doi:10.1149/07509.0103ecst

Au/SiO₂ hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors

Yuki Honda, Kei Hagiwara, Masahide Goto, Toshihisa Watabe, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Hiroshi Toshiyoshi, Eiji Higurashi, Toshiro Hiramoto

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

A 3D structured CMOS image sensor that can process signals pixel-wise in parallel is investigated as a means to simultaneously increase the pixel count and the frame rate. To make the pixel pitch finer, the Au electrode dimension is reduced to a 6-μm pitch that is electrically interconnected using a direct-bonding technique. We also develop a daisy-chain test device to examine the numerous interconnections. The experimental results show that the series of electrical interconnections exceeds 230,000 contacts, with the Au contact resistance for a single connection being ∼23.6 mω.

Original language	English
Title of host publication	Semiconductor Wafer Bonding
Subtitle of host publication	Science, Technology and Applications 14
Editors	T. Suga, H. Baumgart, F. Fournel, M. S. Goorsky, K. D. Hobart, R. Knechtel, C. S. Tan
Publisher	Electrochemical Society Inc.
Pages	103-106
Number of pages	4
Edition	9
ISBN (Electronic)	9781607687269, 9781607687672, 9781607687689, 9781607687696, 9781607687702, 9781607687719, 9781607687726, 9781607687733, 9781607687740, 9781607687757, 9781607687771, 9781607687788, 9781607687795, 9781607687801, 9781607687818, 9781607687825, 9781607687832, 9781607687849, 9781607687856, 9781607687863, 9781607687887, 9781607687894, 9781607687900, 9781607687917, 9781607687924, 9781607687931, 9781607687948, 9781607687955, 9781607687962, 9781607687979, 9781607687986, 9781607687993, 9781607688006, 9781607688013, 9781607688020, 9781607688037
DOIs	https://doi.org/10.1149/07509.0103ecst
Publication status	Published - 2016
Externally published	Yes
Event	Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting - Honolulu, United States Duration: 2016 Oct 2 → 2016 Oct 7

Publication series

Name	ECS Transactions
Number	9
Volume	75
ISSN (Print)	1938-6737
ISSN (Electronic)	1938-5862

Other

Other	Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting
Country/Territory	United States
City	Honolulu
Period	16/10/2 → 16/10/7

ASJC Scopus subject areas

Engineering(all)

Access to Document

10.1149/07509.0103ecst

Cite this

Honda, Y., Hagiwara, K., Goto, M., Watabe, T., Nanba, M., Iguchi, Y., Saraya, T., Kobayashi, M., Toshiyoshi, H., Higurashi, E., & Hiramoto, T. (2016). Au/SiO₂ hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors. In T. Suga, H. Baumgart, F. Fournel, M. S. Goorsky, K. D. Hobart, R. Knechtel, & C. S. Tan (Eds.), Semiconductor Wafer Bonding: Science, Technology and Applications 14 (9 ed., pp. 103-106). (ECS Transactions; Vol. 75, No. 9). Electrochemical Society Inc.. https://doi.org/10.1149/07509.0103ecst

Au/SiO₂ hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors. / Honda, Yuki; Hagiwara, Kei; Goto, Masahide et al.

Semiconductor Wafer Bonding: Science, Technology and Applications 14. ed. / T. Suga; H. Baumgart; F. Fournel; M. S. Goorsky; K. D. Hobart; R. Knechtel; C. S. Tan. 9. ed. Electrochemical Society Inc., 2016. p. 103-106 (ECS Transactions; Vol. 75, No. 9).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Honda, Y, Hagiwara, K, Goto, M, Watabe, T, Nanba, M, Iguchi, Y, Saraya, T, Kobayashi, M, Toshiyoshi, H, Higurashi, E & Hiramoto, T 2016, Au/SiO₂ hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors. in T Suga, H Baumgart, F Fournel, MS Goorsky, KD Hobart, R Knechtel & CS Tan (eds), Semiconductor Wafer Bonding: Science, Technology and Applications 14. 9 edn, ECS Transactions, no. 9, vol. 75, Electrochemical Society Inc., pp. 103-106, Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications 14 - PRiME 2016/230th ECS Meeting, Honolulu, United States, 16/10/2. https://doi.org/10.1149/07509.0103ecst

Honda Y, Hagiwara K, Goto M, Watabe T, Nanba M, Iguchi Y et al. Au/SiO₂ hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors. In Suga T, Baumgart H, Fournel F, Goorsky MS, Hobart KD, Knechtel R, Tan CS, editors, Semiconductor Wafer Bonding: Science, Technology and Applications 14. 9 ed. Electrochemical Society Inc. 2016. p. 103-106. (ECS Transactions; 9). doi: 10.1149/07509.0103ecst

Honda, Yuki ; Hagiwara, Kei ; Goto, Masahide et al. / Au/SiO₂ hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors. Semiconductor Wafer Bonding: Science, Technology and Applications 14. editor / T. Suga ; H. Baumgart ; F. Fournel ; M. S. Goorsky ; K. D. Hobart ; R. Knechtel ; C. S. Tan. 9. ed. Electrochemical Society Inc., 2016. pp. 103-106 (ECS Transactions; 9).

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