Atomic-order thermal nitridation of Si, Si1-x Gex and Ge by NH3

Junichi Murota, Masao Sakuraba, Bernd Tillack

Research output: Contribution to journalConference articlepeer-review

4 Citations (Scopus)


One of the main requirements for Si-based ultrasmall device is atomic-order control of process technology. Here, we show the concept of atomically controlled processing for group IV semiconductors based on atomic-order surface reaction control in Si-based CVD epitaxial growth. On the atomic-order surface nitridation of Si1-xGex by NH3, it is suggested that nitridation of Si atoms proceeds by transfer of N atoms from Ge atoms by heattreatment. In the case of epitaxial Ge film, the crystallinity change is not observed by NH3 treatment and N atoms diffuse through nmorder thick Ge layer into Si (100) substrate and form Si nitride even at 500 °C. It is also suggested that N diffusion in Ge layer is suppressed by the formation of Si nitride. These results demonstrate the capability of CVD technology for atomically controlled nitridation of Si, Si1-xGex and Ge for ultralarge scale integration.

Original languageEnglish
Pages (from-to)97-104
Number of pages8
JournalECS Transactions
Issue number2
Publication statusPublished - 2014 Jan 1
Event6th International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliability and Manufacturing - 225th ECS Meeting - Orlando, United States
Duration: 2014 May 112014 May 15

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Atomic-order thermal nitridation of Si, Si<sub>1-x</sub> Ge<sub>x</sub> and Ge by NH<sub>3</sub>'. Together they form a unique fingerprint.

Cite this