Atomic hydrogen etching of silicon-incorporated diamond-like carbon films prepared by pulsed laser deposition

We have deposited Si-DLC films by pulsed laser deposition using KrF excimer laser, and have investigated etching of the Si-DLC films by atomic hydrogen. We have examined the structure and chemical bonding of the films by Raman spectroscopy, X-ray photoelectron spectroscopy and photoelectron spectroscopy using synchrotron radiation. Photoelectron spectra of Si 2p with 135 eV photons showed two distinguishing components. The main components were identified with Si-C and silicon oxides. The intensity of the oxide component increased when the detection angle to the surface normal was increased from 0 to 60°, indicating that thin oxide layers were formed at the surface. The oxide component decreased by annealing at a substrate temperature above 850 °C in an ultra-high vacuum and it disappeared at 1050 °C. We found that the etching rate of the films drastically decreased by the incorporation of Si. It was also found that the etching rate of the Si-DLC films markedly increased after dipping in a HF solution, indicating that the hydrogen etching of the Si-DLC films is suppressed by thin oxide layers formed at the surfaces. When the HF-treated Si-DLC films were annealed at a temperature above 400 °C in a high vacuum chamber, the etching rate decreased, suggesting that oxide layers were formed again at the surfaces.