Atomic force microscopy study of plastic deformation and interfacial sliding in Al thin film: Si substrate systems due to thermal cycling

M. W. Chen, I. Dutta

    Research output: Contribution to journalArticle

    23 Citations (Scopus)

    Abstract

    A method is proposed to measure the plastic deformation of thin metallic films on Si substrates induced by thermal cycling. The cross-sectional profiles of pattern-grown square Al films with a thickness of ∼250nm and a size of ∼6 μm × 6 μm were measured before and after thermal cycling by employing an atomic force microscope. With the assistance of statistical analysis, the change in the size and shape of the thin films were determined. Based on theoretical considerations, the thermal cycling deformation of thin films is attributed to creep and plasticity effects, accommodated by diffusion-controlled interfacial sliding.

    Original languageEnglish
    Pages (from-to)4298-4300
    Number of pages3
    JournalApplied Physics Letters
    Volume77
    Issue number26
    DOIs
    Publication statusPublished - 2000 Dec 25

    ASJC Scopus subject areas

    • Physics and Astronomy (miscellaneous)

    Fingerprint Dive into the research topics of 'Atomic force microscopy study of plastic deformation and interfacial sliding in Al thin film: Si substrate systems due to thermal cycling'. Together they form a unique fingerprint.

  • Cite this