Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas

Takehito Shimatsu; M. Uomoto

doi:10.1109/LTB-3D.2012.6238077

Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas

Takehito Shimatsu, M. Uomoto

Advanced Interdisciplinary Research Division

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Atomic diffusion bonding (ADB) of two flat wafers in an inert gas with thin metal films was studied. Its performance was compared to that of ADB "in vacuum." Results suggest that ADB can be conducted in Ar gas using almost any metal film, as is true also for bonding in vacuum.

Original language	English
Title of host publication	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Number of pages	1
DOIs	https://doi.org/10.1109/LTB-3D.2012.6238077
Publication status	Published - 2012 Aug 15
Event	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan Duration: 2012 May 22 → 2012 May 23

Publication series

Name	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Other

Other	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Country/Territory	Japan
City	Tokyo
Period	12/5/22 → 12/5/23

ASJC Scopus subject areas

Computer Graphics and Computer-Aided Design
Computer Vision and Pattern Recognition

Access to Document

10.1109/LTB-3D.2012.6238077

Cite this

Shimatsu, T., & Uomoto, M. (2012). Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 [6238077] (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238077

Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas. / Shimatsu, Takehito; Uomoto, M.

Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. 6238077 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shimatsu, T & Uomoto, M 2012, Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238077, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, Japan, 12/5/22. https://doi.org/10.1109/LTB-3D.2012.6238077

Shimatsu T, Uomoto M. Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. 6238077. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238077

@inproceedings{0f9d38e36bfc48a38627f8450bd9b9cc,

title = "Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas",

abstract = "Atomic diffusion bonding (ADB) of two flat wafers in an inert gas with thin metal films was studied. Its performance was compared to that of ADB {"}in vacuum.{"} Results suggest that ADB can be conducted in Ar gas using almost any metal film, as is true also for bonding in vacuum.",

author = "Takehito Shimatsu and M. Uomoto",

year = "2012",

month = aug,

day = "15",

doi = "10.1109/LTB-3D.2012.6238077",

language = "English",

isbn = "9781467307420",

series = "Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012",

booktitle = "Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012",

note = "2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 ; Conference date: 22-05-2012 Through 23-05-2012",

}

TY - GEN

T1 - Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas

AU - Shimatsu, Takehito

AU - Uomoto, M.

PY - 2012/8/15

Y1 - 2012/8/15

N2 - Atomic diffusion bonding (ADB) of two flat wafers in an inert gas with thin metal films was studied. Its performance was compared to that of ADB "in vacuum." Results suggest that ADB can be conducted in Ar gas using almost any metal film, as is true also for bonding in vacuum.

AB - Atomic diffusion bonding (ADB) of two flat wafers in an inert gas with thin metal films was studied. Its performance was compared to that of ADB "in vacuum." Results suggest that ADB can be conducted in Ar gas using almost any metal film, as is true also for bonding in vacuum.

UR - http://www.scopus.com/inward/record.url?scp=84864860556&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84864860556&partnerID=8YFLogxK

U2 - 10.1109/LTB-3D.2012.6238077

DO - 10.1109/LTB-3D.2012.6238077

M3 - Conference contribution

AN - SCOPUS:84864860556

SN - 9781467307420

T3 - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

BT - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

T2 - 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Y2 - 22 May 2012 through 23 May 2012

ER -

Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas

Abstract

Publication series

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this