TY - GEN
T1 - Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas
AU - Shimatsu, Takehito
AU - Uomoto, M.
PY - 2012/8/15
Y1 - 2012/8/15
N2 - Atomic diffusion bonding (ADB) of two flat wafers in an inert gas with thin metal films was studied. Its performance was compared to that of ADB "in vacuum." Results suggest that ADB can be conducted in Ar gas using almost any metal film, as is true also for bonding in vacuum.
AB - Atomic diffusion bonding (ADB) of two flat wafers in an inert gas with thin metal films was studied. Its performance was compared to that of ADB "in vacuum." Results suggest that ADB can be conducted in Ar gas using almost any metal film, as is true also for bonding in vacuum.
UR - http://www.scopus.com/inward/record.url?scp=84864860556&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84864860556&partnerID=8YFLogxK
U2 - 10.1109/LTB-3D.2012.6238077
DO - 10.1109/LTB-3D.2012.6238077
M3 - Conference contribution
AN - SCOPUS:84864860556
SN - 9781467307420
T3 - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
BT - Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
T2 - 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Y2 - 22 May 2012 through 23 May 2012
ER -