Atomic diffusion bonding using Y2O3 and ZrO2 films

T. Shimatsu; H. Yoshida; M. Uomoto; T. Saito; T. Monwaki; N. Kato; Y. Miyamoto; K. Miyamoto

doi:10.1109/LTB-3D53950.2021.9598449

Atomic diffusion bonding using Y₂O₃ and ZrO₂ films

T. Shimatsu, H. Yoshida, M. Uomoto, T. Saito, T. Monwaki, N. Kato, Y. Miyamoto, K. Miyamoto

Advanced Interdisciplinary Research Division

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We demonstrated atomic diffusion bonding (ADB) of wafers at room temperature using Y₂O₃ and ZrO₂ films. Results showed that bonded interface disappeared perfectly (Y₂O₃ films) or partially (ZrO₂ film) at room temperature, implying high bonding potential using these oxide films in ADB.

Original language	English
Title of host publication	2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	51
Number of pages	1
ISBN (Electronic)	9781665405676
DOIs	https://doi.org/10.1109/LTB-3D53950.2021.9598449
Publication status	Published - 2021 Oct 5
Event	7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021 - Virtual, Online, Japan Duration: 2021 Oct 5 → 2021 Oct 11

Publication series

Name	2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021

Conference

Conference	7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Country/Territory	Japan
City	Virtual, Online
Period	21/10/5 → 21/10/11

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/LTB-3D53950.2021.9598449

Cite this

Shimatsu, T., Yoshida, H., Uomoto, M., Saito, T., Monwaki, T., Kato, N., Miyamoto, Y., & Miyamoto, K. (2021). Atomic diffusion bonding using Y₂O₃ and ZrO₂ films. In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021 (pp. 51). (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/LTB-3D53950.2021.9598449

Atomic diffusion bonding using Y₂O₃ and ZrO₂ films. / Shimatsu, T.; Yoshida, H.; Uomoto, M.; Saito, T.; Monwaki, T.; Kato, N.; Miyamoto, Y.; Miyamoto, K.

2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 51 (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Shimatsu, T, Yoshida, H, Uomoto, M, Saito, T, Monwaki, T, Kato, N, Miyamoto, Y & Miyamoto, K 2021, Atomic diffusion bonding using Y₂O₃ and ZrO₂ films. in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021, Institute of Electrical and Electronics Engineers Inc., pp. 51, 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021, Virtual, Online, Japan, 21/10/5. https://doi.org/10.1109/LTB-3D53950.2021.9598449

Shimatsu T, Yoshida H, Uomoto M, Saito T, Monwaki T, Kato N et al. Atomic diffusion bonding using Y₂O₃ and ZrO₂ films. In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 51. (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021). https://doi.org/10.1109/LTB-3D53950.2021.9598449

Shimatsu, T. ; Yoshida, H. ; Uomoto, M. ; Saito, T. ; Monwaki, T. ; Kato, N. ; Miyamoto, Y. ; Miyamoto, K. / Atomic diffusion bonding using Y₂O₃ and ZrO₂ films. 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 51 (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).

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